Electronics Forum | Thu Mar 23 06:38:30 EST 2006 | pavel_murtishev
Good afternoon, We can use type-3 solder paste, but what for? Type-3 solder particles are larger than type-4. Probably this will cause even worse release. BR, Pavel
Electronics Forum | Tue Apr 11 15:40:08 EDT 2006 | caldon
I would be leary of a "Sucking" machine and hot liquid solder. Kester makes pellets that you put on top of the pot to seperate dross from lead. Technical Devices has a solder recovery machine Cal Agilent Technologies
Electronics Forum | Sun May 07 19:29:52 EDT 2006 | Dhanish
I am seeing high solder bridging for Nexlev Connector.Can someone advise what are the factors causing Solder Brdiging for Nexlev issues.
Electronics Forum | Thu Jun 01 05:06:10 EDT 2006 | EC
Hi, I facing some 1005 component with poor wetting and look like not enough solder...... Is there any standard solder paste volume requirement. Appreciate all the input.
Electronics Forum | Wed Jul 05 13:30:37 EDT 2006 | Chris Griffin
Likely causes of this are: -Preheat temp. too low -too much dross -uncured epoxy -PCB contamination ...also varify the solder flow over the wave is smooth.
Electronics Forum | Thu Jul 06 04:41:58 EDT 2006 | Rob
MF300S is quite an old flux, & a lot has happened since then on the flow solder front - are you sure it's designed for Lead free, or is it just a traditional flux that SHOULD work OK with Lead free?
Electronics Forum | Mon Jul 10 21:20:05 EDT 2006 | davef
We'd: * Clamp vice grips on the leads to keep movement of the leads from weakening the seal between the leads and the plastic body of the device. * Bend each lead skyward [90* to the deck] at a different distance from the body. * Wrap the insulated w
Electronics Forum | Tue Jul 18 03:04:46 EDT 2006 | sharifudin
We are trying to reduce the number of unit fail at QA Visual Inspection due to Solder On Gold Finger. We know so far that the solder is spattering onto the Gold Finger during reflow. I need some advise on what kind of process can improve to reduce th
Electronics Forum | Tue Jul 18 19:20:25 EDT 2006 | sharifudin
Actually we run lead free solder paste and the profile spec very tigh.I can't use capton tape due my product in panel form and save cost.I already verify conveyor,machine and tool free from dust and solder paste but the problem still remain.
Electronics Forum | Sat Jul 29 08:52:09 EDT 2006 | davef
This recipe is nice for leaded soldering. The time above liquidous plus 20*C is too short for mixed alloy soldering. Remember all that nonleaded stuff that you add to the solder acts to increase the liquidous temperature of the alloy. Try slowing
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