Electronics Forum | Tue May 31 21:39:46 EDT 2005 | davef
We not sure what your supplier means either. So, maybe it's worth a follow-up call. One possibility is: The HASL could be lead-free as easily as it could be SnPb. You probably need to think about how you're going to change your reflow recipe to in
Electronics Forum | Fri Jun 03 14:55:15 EDT 2005 | Bman
Both our Quad ZCR and our Conceptronic HVN-102 ovens have had blowers out with no alarms raised. We knew there were problems based on how boards were soldering, but don't count on your oven to tell you if anything is wrong with it. We verify once a
Electronics Forum | Fri Jun 03 14:31:33 EDT 2005 | Peter
I am working on an application requiring removing BGAs from a board coated with parylene. These BGAs have low standoff with less than 0.015" after SMT soldering. Can some comment on a reliable and consistent process to perform such rework? given tha
Electronics Forum | Wed Jun 08 13:06:36 EDT 2005 | jimby
You will have to machine the part off down to the top of the balls. Wick solder off from individual sites one at a time. All that will be left is Parylene shell where balls once were. Take an orangestick and alcohol to break up and remove. Tricky par
Electronics Forum | Tue Jun 07 19:24:26 EDT 2005 | Joseph
Dear all, Recently we encountered some functionality failure when using lead-free component(Sn99.3/Cu0.7)at SnPb(Sn63Pb37) wave soldering process. Can lead-free component use at non-lead free process? Any input/idea are much appreciated. Rgds
Electronics Forum | Thu Jun 09 11:07:31 EDT 2005 | vikkaraja
I work for a rather large company. what job title do I fit in? My current title is maintanence Tech. III. What do I look for, beacause maintanence is a very broad term. I do fuji Flexa programming, Fuji smt reapair troubleshooting, MPM solder print
Electronics Forum | Sat Jun 11 07:24:26 EDT 2005 | buchi79
Russ, Thanks.By the way, i already look into the reflow profile & paste storage & thowing requirement. Even i cut down the stencil life to 4 hr to avoid any moisture absorbtion. If i were to change the paste formulation, what would you propose ? But
Electronics Forum | Mon Jun 13 01:31:36 EDT 2005 | buchi79
Devef, The stand off height is 75micron. We only clean the product after underfill process. Dispense epoxy under the FC & cure it before aqueous wash. Samples are sent for LPC (liquid particle count) Test to ensure cleaniness. By the way, our plant
Electronics Forum | Tue Jun 21 07:39:23 EDT 2005 | davef
There's a fair amount of material on cooling rates for lead free on the web. Look here: * http://www.speedlinetech.com/docs/Cooling-Slopes-Lead-Free-Reflow.pdf * http://www.findarticles.com/p/articles/mi_qa3776/is_200412/ai_n9473486 * http://www.m
Electronics Forum | Thu Jun 16 18:11:33 EDT 2005 | Jason Fullerton
The IPC standards have NO bearing on the state of the RoHS Directive - Europe isn't going to change the rules because the IPC has a few draft standards floating around that create a category "RoHS Compliant, except I still have lead in my solder". Th
