Electronics Forum | Thu Oct 26 07:02:34 EDT 2017 | jamesbarnhart
Please share your tips with me that how we can choose equipment for selective soldering or for any other soldering.
Electronics Forum | Fri Dec 01 14:55:51 EST 2017 | kojotssss
Rework said that with hot air gun, heated the solder paste comes out of the middle part out to the side terminals and soldering extending beyond is perfect.
Electronics Forum | Fri Nov 17 11:03:32 EST 2017 | davef
IPC-A-610F, 10.1, Non-Soldered Contact Areas: Has words to the effect that for Class 1, 2, 3; it is defect to have solder or any other contamination in the critical contact area.
Electronics Forum | Sun Mar 25 08:49:49 EDT 2018 | jacobidiego
Hi experts, Is it normal that a stencil of 0,1mm would produce 45% solder paste volume being printed over the board? Or is a property linked to the solder paste? thanks in advance
Electronics Forum | Tue Mar 27 06:27:41 EDT 2018 | cyber_wolf
Occasionally when circuit boards are manufactured, there may be issues with solder mask coverage. It is not uncommon to re-run back through this process to fix missing or thin areas. This can causes the traces to become higher which in turn raises th
Electronics Forum | Wed Apr 18 13:29:49 EDT 2018 | slthomas
I did not read through this but hopefully there is something of value here: https://www.smtnet.com/library/files/upload/Design-Rules-Selective-Soldering.pdf
Electronics Forum | Wed Apr 18 14:26:31 EDT 2018 | dleeper
One thing to consider is the length of the leads protruding from the solder side of the PCB will have an effect. Longer leads will be more prone to bridging than shorter leads with the same spacing.
Electronics Forum | Thu May 03 15:02:59 EDT 2018 | solderingpro
Bob Willis (was the first I knew of) that has a splatter test that can be performed over a ceramic hot plate or the like. The concept is pretty straight forward, using a zoned circle, users can introduce the solder wire at a consistent rate and coun
Electronics Forum | Fri May 25 12:52:12 EDT 2018 | oscardeharo
What would be the least and optimum solder paste coverage for good BGA solderability? Are there any studies for that? Thanks.
Electronics Forum | Fri Aug 24 08:49:54 EDT 2018 | davef
My first guess at the cause of your components skewing -- Termination pads on the board to not well match the the soldered terminals on the components, causing unbalanced wetting forces on the component terminations while the solder is molten.
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