Electronics Forum | Fri Mar 25 05:33:18 EDT 2011 | Nigel, RAKON
We have the occasional solder fine but the main issue I have is with small - large balls of solder around an 0402 capacitor. Our LF paste data sheet states a %rH of 25 - 70, I have recorded an average for March of 14.9 - 38.5 %rH. Every other requirm
Electronics Forum | Wed Jun 01 10:33:18 EDT 2011 | tzhangaclara
Hello, Attached is the X-ray picture of a SMT transistor. Please give me your opinion whether this is a good solder or not. From my view, I did not see any solder in the middle pad. I feel it is a production problem. But someone told me unless you s
Electronics Forum | Thu Jun 02 13:32:05 EDT 2011 | davef
Melanie: We're with AVFOM. If you don't believe there is solder on the pads, use a beer can opener to pop the component off the board and you will have your answer. Easy-peasy. Who ever told you 'if there is solder, there is voids' in solder connect
Electronics Forum | Thu Jun 23 23:58:03 EDT 2011 | jamessunderland
Just want to ask. What is the effect of dull gold surface on solderability? When I made a test run with several pieces containing dull gold defect on the pad(of varying levels), I found that components can still stick to the pad with good amount o
Electronics Forum | Fri Jul 08 08:01:32 EDT 2011 | joekirin
Hello, I am having a problem with a large amount of solder balls surrounding mostly the legs of fine pitch ics. There seems to be a large collection in gap between the pad and the solder resist. They do not easily wash out. Our profile seems to be
Electronics Forum | Fri Jul 08 10:21:21 EDT 2011 | davef
OK. You used a thermometer to to check your recipe. How do know that the temperatures that you selected are correct? Your solder balls indicates that it's possible that the temperatures that you selected might not be correct. Without belaboring an
Electronics Forum | Fri Aug 19 06:49:27 EDT 2011 | leadthree
I got this MQFP-144 and the soldering looks always very flimsy. I think I use a suitable leaded paste (water-soluble) and the stencil thickness is also OK. The IC on the image looks a bit shifted, that's not the problem. The problem is rather that
Electronics Forum | Mon Aug 22 13:28:47 EDT 2011 | scottp
No, don't put weight on it. If the part is really "floating" on the solder and not wetting properly and the solderability looks good on all your other parts then I'd suspect a part problem. Get with the QFP supplier and make sure the Sn isn't too t
Electronics Forum | Wed Aug 24 12:37:38 EDT 2011 | hussman
Hello all, We just got some board back from thermal shock and we found that several of the 2512 resistors opened up. Actaully the solder joint cracked away from the board. All other coponents look great. Boards were good before test. 10 layer bo
Electronics Forum | Thu Sep 22 10:28:48 EDT 2011 | davef
We agree with you. Recognize that these new solder connections have less metal and a lower standoff than similar BGA solder connections that have not been reworked. This could reduce the reliability of your product, somewhat. Flux or gel may be use
.gif)
winsouce.jpg)