Electronics Forum | Mon Apr 19 10:52:05 EDT 2010 | esca
Hi, if you want to verify the gold contamination, is mandatory to use the XPS and FTIR analysis, but is difficult think about a gold contamination from 3 different manufacturers. Do you have cleaned the PCBs after an erroneous screen process ? If no
Electronics Forum | Thu Sep 16 13:12:43 EDT 2010 | gregcr
Hi All, We have been running a Novastar spartan 8S wave solder machine for a number of years. We actually do very little wave soldering and this machine has served us well. I have always been of the opinion that with the small pot and simple fluxe
Electronics Forum | Tue Nov 09 04:21:11 EST 2010 | bising
Hi SMT World, I am facing a technical challenge related to an SOIC 14lds with thermal pad on it's belly that needs to be soldered onto PCB, together with leads. It is a 50 per board, expected 80% solder load on every one. We have some units without
Electronics Forum | Thu Jun 02 14:57:36 EDT 2011 | davef
We don't expect properly soldered first-side DPAKs to fall from the board during second-side reflow. The ratio of weight to solder surface area for a DPAK is 1.32 gm per in^2, which is well within the limit of 44 gm per in^2. [Search the fine SMTnet
Electronics Forum | Fri Jul 08 09:30:35 EDT 2011 | kahrpr
Check that your pick and place machine is not pushing the part too far in the paste and squeezing the paste off the pad. Your profile could need modifying. In the case of the profile the solder paste can slump off the pads before turning into a liqui
Electronics Forum | Tue Aug 23 16:48:29 EDT 2011 | jax
assuming Sn05Pb93.5Ag1.5 Without knowing what you are trying to solder, PTH or SMT, the time might not be that far off. Does that time include stripping, cleaning, plating the leads prior to soldering onto the board?... pre-tinning the board as well
Electronics Forum | Wed Dec 07 17:43:31 EST 2011 | mikenil
Hi I do not work for a board house but a manufacturing facility where we do a considerable amount of soldering wires to through holes. We pretin our through holes on both sides of the PCB prior to reflowing the solder and installing the conductor (w
Electronics Forum | Thu Dec 15 10:44:53 EST 2011 | davef
Hi Joe This last sentence was not included in previous versions of J-STD-001. So, the first sentence required that all components, wires and boards had to be tested for solderability prior to use. We're talking 100% testing and inspection. That's bu
Electronics Forum | Thu Sep 13 15:44:02 EDT 2012 | mbnetto
Hi everbody, I'm facing some soldering problems with a Diode (SMA) during wave soldering process. During this process almost all the time one of the component pads have no solder, according to the picture dsc000604 attached. Some considerations: * T
Electronics Forum | Thu Sep 13 21:18:16 EDT 2012 | vergara1
Hello, I was looking at your photos of this diode. I have a two question and I'm sure it maybe a simple fix. One, Is the diode actualy touching the pad;reason I ask is, I see that theres excessive amount of adhesive underneth the part. Two, did you
