Electronics Forum | Tue Dec 12 13:45:23 EST 2000 | justin m
Dross removal is dependent upon the "activity" in your solder pot and the usage of a inert or an "air" atmosphere. The more moving parts that agitate the solder and expose it to air, the more dross. Basics first and then the answers will make sense
Electronics Forum | Mon Jan 25 10:59:01 EST 1999 | Ng
| | It has been known that sufficient cooling after soldering is important in order to get a stronger joint during its solidification stage. And it has been so much emphasised with reflow oven. But, why many models of wave soldering machine do not co
Electronics Forum | Wed Jan 20 21:25:32 EST 1999 | Tony A
| I get white residue on my PCBs after vapor degreasing. No comments on the vapor degreaser. Yes, I still use one of these. I use a vapor degreaser and a 1,1,1 replacement solvent due to the quick clean and quick dry times. Anyway, I only get whi
Electronics Forum | Tue Sep 22 12:25:31 EDT 1998 | Chrys
| | Hi Jacqueline! | | Do these joints that you're having problems with happen to be on fine pitch solder joints? Are the fillets staying attached to the foot and separating from the pads cleanly? | | If that is true, are there many vias concen
Electronics Forum | Thu Sep 17 10:45:27 EDT 1998 | Justin Medernach
| We have problems with voids when we solder lids to | ceramic flatpackages. | The sealring of the package is gold(100 micro inches or 2.5 micro meters)with a underlayer of Nickel | The solder is attached to the lid (preform) and the solder material
Electronics Forum | Tue Aug 25 20:33:31 EDT 1998 | Karlin
| | | | Hi, | | | | Does anyone has experiences in reflowing Ceramic BGA and found solder wicking ? Solder wicking has the syndrome that solder being wick from the pad and ended up in the leads. | | | | We have rule out the possibility of not printin
Electronics Forum | Fri Jun 19 10:03:46 EDT 1998 | Earl Moon
| Has anyone had experience with placing BGA on gold plated boards. I thought I read a while ago there was a problem with embrittlment causing cracked joints. If anyone has experience with this your feedback would be great. | Mike Mike, We and ind
Electronics Forum | Thu Apr 03 11:57:38 EST 2003 | davef
R4: We see the ball left on the PCB with a flat top and the BGA pad appears to be virgin. D4: Not good. The flat top indicates that the ball melted at one time or another. This pad and ball have seen at least two solder cycles with solder and flux. S
Electronics Forum | Thu Jan 08 16:16:09 EST 2004 | Dean
My first concern would be the choice of solder paste you have. There are better chemistries out there that far exceed the capabilities of the 609 2. Yes, the part will partially float on the solder (assuming plastic qfp). Cross sectioning would sho
Electronics Forum | Tue Jun 13 06:20:45 EDT 2006 | bk
Well grant just to let you know i feel your pain. I've been wavesoldering with sn100c since January and let's say i'm still learning everyday. Some of the typical causes of bridges are not enough flux when the board hits the solder. Also it can be bo
