Electronics Forum | Thu Apr 17 10:38:02 EDT 2003 | davef
While Russ is correct that a little voiding is OK, your level of voiding [customer complains that the solder surface looks bumpy] doesn't give us the ol' warm and fuzzy about their process control. For background: * Search the fine SMTnet Archives.
Electronics Forum | Thu Apr 17 13:00:28 EDT 2003 | Takfire
Russ, The caps are 0603 case size. I am not sure about the manufacturing details, as I work for the capacitor supplier. The manufacturing details are unclear at the moment, as the customer (South of the border) has not released such detailed inform
Electronics Forum | Thu Apr 17 13:35:49 EDT 2003 | davef
A-610 talks to acceptable voiding.
Electronics Forum | Thu Apr 17 17:38:57 EDT 2003 | Takfire
Dave, I am not exactly sure what is driving them to believe that this is a capacitor issue. It is unfortunate, that this belief has slowed their activity in further understanding their manufacturing process. The caps are BME (Base Metal Electrode
Electronics Forum | Thu Apr 17 18:18:34 EDT 2003 | davef
We undoubtedly will take you up on that offer. Please email contact information.
Electronics Forum | Fri Apr 18 09:45:42 EDT 2003 | k_h
Transistors? Are you referring to SOT-23 packages? Are the solder paste and part properly registered before reflow?
Electronics Forum | Thu Apr 24 21:41:18 EDT 2003 | davef
Searching the "forum" on ... solder ... produces one thread. Fershur.] Get rid of the input script and replace it with a ;p
Electronics Forum | Sat May 03 00:58:51 EDT 2003 | ken
Did you check if the height of solder mask between two pads is higher than pads?
Electronics Forum | Sun May 04 22:10:20 EDT 2003 | Thomas
Did u ever try a anti-tombstone solder paste to try to eliminate this problem ??
Electronics Forum | Wed May 07 09:24:33 EDT 2003 | davef
Kris The majority of our tombstoning in very small passive SMT is caused by imperfections in end-cap solderability protection plating.
