Electronics Forum | Thu Dec 16 20:41:56 EST 1999 | TNT
Hey C.K, If you are looking for inspection of the solder paste before reflow, there are many types of inspection: 1.Paste height measurements at random positions 2.3D inspection with shadow contrast capabilities based on an autocad format 3.3D inspec
Electronics Forum | Fri Dec 10 06:06:54 EST 1999 | Wolfgang Busko
Hi Glen, looks like flux or solder mask problem. In your first mail you said that only some boards show these symptoms and others not. First I would check on the differences between those Boards, manufactorer, solder resist, contamination. If that d
Electronics Forum | Tue Dec 07 08:11:04 EST 1999 | Wolfgang Busko
Hi Russ, there�s something I don�t understand about the measures you took. I guess that TAL means time above liquidous and shortening of that time can result in bad dissolution of the protective Au-layer. The necessary time for the Au to mix with you
Electronics Forum | Thu Dec 02 11:28:03 EST 1999 | Mark D. Milward
Dave F. Thanks for the info. I've spoken with Ralph and Les Hymes in the past and have taken Manko seminars before. I read something not long ago that Dr. Juran had written on the subject of Zero-defect soldering programs and was hoping for response
Electronics Forum | Wed Nov 17 15:05:29 EST 1999 | Wade
I have had an Orbotech VT-8000 running in-line for almost a year and have been very pleased. The VT-8000 does everything the application engineers say it can do. The support and honesty provided by the Orbotech staff is outstanding. I talked to Vi
Electronics Forum | Tue Nov 09 11:42:37 EST 1999 | Dave F
Jeff: Try this: ROSA. John�s spot on. I�ll add that it is a fluxless method that reduces the oxides in an aqueous solution. Another source of information is: Trench, M., Hillman, D., Lucey, G., "Environmentally Friendly Closed Loop Soldering,"
Electronics Forum | Fri Nov 05 21:22:34 EST 1999 | chartrain
Amazing in today's technology that people still bake because "that's the way we've alawys done it". Baking is a band aid for poor manufacturing of the PCB. Moisture can become trapped between the layers during buildup. This moisture when it contacts
Electronics Forum | Mon Nov 01 22:16:20 EST 1999 | chartrain
Your problem is common on this solder defect. It is sometimes known as squeeze balls. The formation of these result from excess volumes of paste applied to the pads. Once the paste melts and covers the pad and component termination,the excess has no
Electronics Forum | Fri Oct 22 03:23:37 EDT 1999 | Brian
I agree with John, but Manko has also published 'Soldering Handbook for Printed Circuits and Surface Mounting' (van Nostrand Reinhold, a little more practical and less strong on the theory of his classic one, which is beginning to date (1st published
Electronics Forum | Thu Oct 14 23:01:48 EDT 1999 | Dennis O'Donnell
With loaded boards, warpage can be removed by placing the assembly in a wave solder conveyor pallet as you would if you were going to wave solder the assembly. Place board and fixture in a Blue M forced air oven at 90 C for 30 minutes. Let cool to r
