Electronics Forum: solderers (Page 1506 of 2103)

Using parts with Tin Bismuth plating in tin lead soldering

Electronics Forum | Tue Dec 13 09:15:56 EST 2005 | Samir Nagaheenanajar

5% Bi results in less plasticity * Formation of low temperature (ternerary phases) not detected. I don't advocate the use of Bismuth, per se, but rather I'm just relaying info. that I learned this from a Lead-Free seminar that I attended at Riyadh

How are you guys checking parts for RoHS compliance?

Electronics Forum | Tue Dec 13 21:25:33 EST 2005 | Slaine

the part is a pi filter device, originally the supplier was nanufacturing it with HMP by dipping it, the giving it a Sn62 over dip to maintain solderability, to supply a RoHS compliant product they just left off the Sn62. so yes on compliant part the

Solder Paste Problem (M705)

Electronics Forum | Thu Dec 15 21:23:57 EST 2005 | davef

Welcome. A day and a half seems like a very long time to leave paste on your stencil. We'd expect that the volitiles in the flux would have left the building in that time, making the flux less active. We start with fresh paste at the beginning of

Solder Paste Problem (M705)

Electronics Forum | Fri Dec 16 06:46:12 EST 2005 | Rob

How about keeping a fridge near the line and only putting on the stencil what is needed, then topping up from the jar as & when? As soon as the paste hits the stencil flux will evapourate, and all of that time spent by people in labs developing comp

Solder Paste Problem (M705)

Electronics Forum | Fri Dec 16 08:11:39 EST 2005 | rlackey

Hi Dave, Sorry, blonde moment. For our prototype line we decant the paste into a cleaned out pot, that goes under the printer hood, with the lid left on, the rest stays in the fridge until it starts to run down. If we get it wrong we definitely

Solder Paste Problem (M705)

Electronics Forum | Sat Dec 17 04:45:43 EST 2005 | aswsteven

Hi Guys My is in line system, printer DEK 265 stencil 4 mil only have to mount 20 components but giving me problem. After a month or so on this line still having paste problem about 1.5day need to change new paste. We are using whole jar 250g but do

Flash memory chip fault

Electronics Forum | Fri Dec 16 07:42:05 EST 2005 | pavel_murtishev

Good evening, We noted one more very strange problem with flash memory chips. Device fails test due to flash chip malfunction. From the first sight open joint or cold joint can cause such problem. But all chip legs are soldered well. We just heat th

Encapsulating water soluble flux residue?

Electronics Forum | Fri Dec 16 11:21:18 EST 2005 | patrickbruneel

Steve, Water-soluble fluxes are per definition very corrosive and need to be cleaned (read the data sheet) Encapsulation will prevent humidity reaching the water-soluble acids but will not prevent reducing the metals the flux is in contact with to m

Coating under Mil connector....

Electronics Forum | Wed Jan 04 10:33:34 EST 2006 | jdumont

Dow 3145 or 3140 is exactly what I was going to use on these connectors. Our requirement is to protect every solder joint in our product basically. This connector, being power input and signal out all in one is very important and needs to be protecte

X7R woes

Electronics Forum | Mon Dec 26 12:58:17 EST 2005 | davef

As an alternative theory to the boards being damaged in the wave soldering process, it's possible that the panels are being handled in a way that flexes the panel and breaks the capacitors. In this possibilty, we'd expect capacitors in specific loca


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