Electronics Forum: solderers (Page 1651 of 2103)

Re: Wave Solder Dwell Time

Electronics Forum | Tue Nov 07 08:39:12 EST 2000 | Steve Geldard

Hi Guys, Ive seen your notes on Wave dwell times, we have been doing lots of test across many styles of wave machines. The most inportant thing to understand is that your dwell time does vary across the wave, it can vary as much as 2 to 5 secs from

Re: Wave solder Carrier

Electronics Forum | Wed Nov 01 10:03:42 EST 2000 | Wolfgang Busko

Hi Adam, if your product needs the full width of your wave you won�t have any chance to adjust an angle. For smaller PCB�s you might consider having your carriers made in two pieces. One outer piece to match your transportionsystem and one inner cir

Re: Wave solder Carrier

Electronics Forum | Wed Nov 01 12:04:46 EST 2000 | JohnW

Adam, Didn't we do this already?, check the archives, I've discussed rotational carriers before. You can use them fo setting up an designing the pallet but you can't use them for mass prouction, for one your waisting valuable pallet space, for anoth

Re: How to do with tombstoning for component '0402'

Electronics Forum | Thu Nov 02 03:42:49 EST 2000 | CHRIS MAY

Tombstoning primarily occurs due to the fact that the paste may melt and wet the metallized face of the chip earlier or better at one end than the other. This could be due to a difference in heat capacity (thermal shadowing ?) or that one end of your

Re: Poor soldering on Motorola 357 PBGA

Electronics Forum | Thu Nov 02 22:05:55 EST 2000 | Dason C

Chris, can we share some more information? I am running Motorola 357 BGA with PN XPC860MHZP50C and the problem for me is a large amount of void (checked by 5DX). I checked the ball surface and found some sketch on every single ball (it may caused by

Re: Poor soldering on Motorola 357 PBGA

Electronics Forum | Mon Nov 06 10:52:52 EST 2000 | Glen Mantych

Glenn, we have been fighting perhaps the identical problem for nearly a year on a 1mm pitch BGA, we have performed numerous laboratory analyses of defective joints and virgin parts in an effort to specifically identify the cause of the no-wet joints.

Re: Micro solder balling

Electronics Forum | Thu Oct 26 12:40:49 EDT 2000 | NLykus

Antonio, I would need to have more profile information i.e. preheat temp (hold time) as well as soaking zone (time). What is the peak temperature and how long is it held there. Also, one more thing to check, because I have seen it in the past, is

Re: Solder paste SPC analysis

Electronics Forum | Thu Oct 26 05:26:53 EDT 2000 | Mika Pirttimaa

Well, Yes those measurements are required as long as your process is not in control. It is true that quality people easily demand too much and are too strickt in the areas that are not so important. Height of the pad is one of them, it is not very in

Re: Solder paste SPC analysis

Electronics Forum | Thu Oct 26 12:13:16 EDT 2000 | Steve Thomas

I'd like to respond here not just to throw in my $.01 (I yield at least a penny to the more knowledgeable contributors), but to verify that my thoughts on this are reasonable... How about, you either do in-process inspection or testing, or you valid

Re: Solder paste SPC analysis

Electronics Forum | Fri Oct 27 03:52:39 EDT 2000 | JohnW

Dave, you know the problems about working for a CEM all tose wonderful customers and managers love their graphs! Got 1 eng manager that is pushing everything to double sided reflow (even if the card ain't designed for it!) as he's insisting glue ain


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