Electronics Forum | Fri May 21 10:16:31 EDT 1999 | Parvez
Dave, i tried reflowing bare boards with only solder printed on em and no component placed. we still got voids as same as when components were placed. so atleast one of that theories(voids due to component/component placement)could be considered to b
Electronics Forum | Thu May 13 16:16:33 EDT 1999 | Chrys Shea
Hi Guys, I am going to be graced with the good luck of processing microBGA's in the near future. A bit of a step forward from printing 20-mil pitch and wave soldering 0805's, wouldn't you say? So, any of you folks who have already experienced this
Electronics Forum | Fri May 14 18:34:28 EDT 1999 | Earl Moon
| What is the best way to re-ball a BGA? Who has the best system for doing it? | I'm using our SRT rework stuff to reball in house - when necessary. Of course, we only do this for protos and test boards. We use a standard micro-stencil, after clean
Electronics Forum | Mon May 10 15:49:52 EDT 1999 | Steve Gregory
| | Can anyone tell me what the recommended "typical" cooling rates are after reflow? Are the cooling rates considered as critical to control as the heating rates and why/why not? | | I do not think there is a "typical" post reflow cooling rate out
Electronics Forum | Wed May 05 10:57:25 EDT 1999 | Kevin Hussey
| | | Ok folk's has anyone used Alpha Metal's UP78 solder paste ? | | | | | | Our place is looking to move to that as the way to go, getting rid of the Hereaus 362's and Alpha 737's of the current set up. | | | | | | My question's are really : | |
Electronics Forum | Tue Apr 27 12:19:17 EDT 1999 | John
Has anybody had experience wavesoldering 1 watt 2512 resistor packages?? I know it can be done, but are there reliability issues? We are in the middle of a new product and the question was posed to me "Can we use 2512 1 watt resistors on the bottom
Electronics Forum | Tue Apr 20 17:56:42 EDT 1999 | Chrys Shea
| | I am wondering if anyone has any info regarding solder paste misprint clean-up procedures for Entek Plus CU-106A PCB's utilizing a water-clean solder paste. In a implementation procedure they recommend a 2-3 minute wash cycle with the following
Electronics Forum | Sat Apr 10 01:11:37 EDT 1999 | forest
Our company is going to use BGA(1.27mm pitch) But I have heard of troubles with P-BGA. It is that cracks occured between solderball and gold plating of PCB during ICT(incircuit test). We know that gold plating of PWB is not good for BGA, so we decide
Electronics Forum | Fri Apr 02 22:01:19 EST 1999 | Dean
| Anyone knows what is the optimum squeegee angle for screen printers. | | 45 Degrees. The forward velocity creates a downward pressure equal to the vector pressure (equalibrium). This is commonly known as paste "rolling action". Too obtuse an an
Electronics Forum | Fri Apr 02 11:32:09 EST 1999 | Bob Willis
| Does anybody put QFP's on the backsides of boards? Can they be reflowed without falling off? Do you use adhesive? | Yes you can reflow them upside down either by Double Sided Reflow or by Simultanous Double Sided Reflow. Many Asian companies wav
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