Electronics Forum | Tue Jan 23 20:53:51 EST 2001 | davef
Sorry, not much help for me there. More information would be helpful. For instance: * Talk about the distribution of the problem, including a single lot or from various lots and over components and component types on the board * Tell us about the boa
Electronics Forum | Thu Feb 22 04:00:02 EST 2001 | Scott B
We are increasingly being asked to store components for longer and longer periods which we know through experience leads to reduction or total loss of solderability of the parts. 1) What is the industry accepted shelf life of tin/lead plated compone
Electronics Forum | Tue Feb 27 03:35:23 EST 2001 | peterbarton
Steve, I have to support the comments made by Dave F. Provided the surface mount parts on the second side are correctly orientated and not too close to any adjacent through hole leads then the best option has to be to print glue then wave solder. T
Electronics Forum | Mon Mar 12 10:13:43 EST 2001 | CAL
At APEX I was able to witness the BEAM WORKS Selective Laser Soldering machine operate.Truly impressive. When they told me they could solder a BGA component, I old them they were HIGH as a kite. The board they demonstrated had 4 BGA's on it. When the
Electronics Forum | Tue Mar 13 20:25:39 EST 2001 | davef
So, what is not soldering? Pads er test points? I assume the holes are unsupported, right? Tell us more about the test points. Are they the kind with the little pastic shoulders [on the primary side] that keep them from falling through the hole?
Electronics Forum | Thu Mar 15 17:19:12 EST 2001 | mparker
Are the tin/lead ratios compatible betweem HASL and wave solder? Probably are, just a remote possibility. Flux application is? bubbler, sprayer? Either way, are you getting good misting, coverage on those teeny 0.5mm test points? If not, then no
Electronics Forum | Fri Apr 06 09:02:20 EDT 2001 | CAL
FYI- Toe Fillets have not been required per IPC 610b/c (they are nice to have though). Remember before Solder paste inspection equipment The Solder powder type/size, stencil type, and apertures are what defined volume. The need has not been until rec
Electronics Forum | Mon Jun 25 20:54:28 EDT 2001 | davef
No, I�m suggesting an increase in the distance between the two pads on the board. This "G" in SM-782A "Surface Mount design & Land Pattern Standard" parlance. You shouldn�t fight solder balls for long periods. You should just increase the pressure
Electronics Forum | Mon Jun 25 06:07:56 EDT 2001 | mzaboogie
Hello, I have a board that has been giving us problems for some time now. It is fairly well populated, mostly with IC's and SOT's on the topside. There is a Zilinx QFP160. This component does not reflow well. All of the other components look OK. A t
Electronics Forum | Tue Jul 03 11:56:13 EDT 2001 | Russ Roberts
I am a Manufacturing Engineer working on a new bid. Please help with my question about a new process that I am unfamiliar with: The Assy that we are quoting involves a SMT PCA that is soldered to an aluminum chassis. All surfaces of the chassis that
