Electronics Forum | Wed Sep 23 00:06:34 EDT 2020 | SMTA-64387098
I have modules that come with a 4 x 2 pin header. The problem is the pins must be oxidized as they do not take solder (no wetting occurring). This occurs whether solder in our wave soldering machine or soldered by hand. I tried cleaning the module i
Electronics Forum | Fri Mar 25 21:40:05 EDT 2022 | cbeneat
I have a question for the Wave/selective Solder experts. We use a solder bath to Tin the legs of Transformers that are made in house. We use a Marselli BK4. It uses 50/50 solder. The question is, at what temp is best for this solder. Anyone use this
Electronics Forum | Tue Jul 18 00:02:41 EDT 2023 | hazira1991
Yes. i do check all the parameter all seams good. I did compare my solder paste printing and profile with previous lot that did not have any BGA solder short issue which we run at the same line did not have any much difference. During rework also i
Electronics Forum | Thu Sep 04 10:24:39 EDT 2003 | paulrm
The typical PIP process is incorporated into the surface mount process. This approach requires the following: The stencil will be designed so that the correct amount of solder paste can be printed onto the through-holes to form an acceptable joint
Electronics Forum | Wed Jan 03 12:33:37 EST 2001 | Terry Burnette
John, There is one process issue that occurs with the larger BGA packages which have coplanarity near the high end of the .2mm spec.. The defect is commonly referred to as "ball in cup" and "head in pillow". It is an open solder connection whereby th
Electronics Forum | Tue Jun 10 16:51:19 EDT 2003 | davef
Develop your recipe wave soldering exactly as you developed your recipe for reflow soldering. The only difference is that instead of using your paste supplier's recommendations as the starting point, use your flux supplier's recommendations as a bas
Electronics Forum | Thu Jun 08 01:46:00 EDT 2023 | camilleyang3
To prevent BGA (Ball Grid Array) issues related to SMT (Surface Mount Technology) solder resist when fabricating a PCBA (Printed Circuit Board Assembly), you can follow these guidelines: Design considerations: Ensure proper spacing between BGA pads
Electronics Forum | Mon Feb 19 18:57:49 EST 2001 | davef
Expanding on the limit of the portion of gold acceptable in a solder connection [mentioned in an earlier post]: The embrittlement culprit, AuSn4, is 29 weight percent gold. So even if one had 100% tin as the solder alloy and 10% gold were dissolved
Electronics Forum | Fri Oct 08 10:08:48 EDT 1999 | Glenn Robertson
| | | | I have a board, 4 spacers needed to be soldered on the board | | | | first with the normal 62Sn37Pb alloy. Then, capacitors are manually soldered on the boards. The density of the board is quite high. If we wave soldered capacitors first,
Electronics Forum | Wed Aug 25 19:44:35 EDT 1999 | Dave F
| Does anyone have any information on stencil aperture/pad ratios for noclean solder paste. In the past I have experienced severe solder ball problems when using the same size apertures from aqueous products as I do with the No-clean products. Cons
