Electronics Forum | Tue Sep 14 14:22:11 EDT 2010 | grahamcooper22
If the HASL was poor quality and very thin you would find this defect....but you would expect to see it on more pads also. Also, you'd expect to see your solder from your solder paste either dewetted on the pad or reflowed onto the BGA sphere making
Electronics Forum | Mon Sep 20 11:21:48 EDT 2010 | tony1
I have this NiPdAu small QFN packge sizes less than 2x2. I tried to do solderability Dip And Look test and there's always some units no wet on either ground pad and small I/O. Can someone help to explain why is this so difficult to set on this surfac
Electronics Forum | Mon Sep 27 06:36:34 EDT 2010 | san_1023
At present, Infrared soldering technology became popular due to stream progress in the field of electronics. The stations become more popular among masters, engaged in repairing of composite printed-circuit boards, BGA reballing, soldering in hard-to
Electronics Forum | Sun Oct 03 13:32:54 EDT 2010 | schen
Hi. there's no other way to do except hand solder the top side cap or using hand print hand place method during SMT process. otherwise you will have to spend more time just to set up this process. bottom line is you have to install this one cap first
Electronics Forum | Fri Oct 29 11:23:51 EDT 2010 | pfloh
Just for your reference. If you need to check for surface contamination, then we shall go for microscope inspection at different modes. But this will not reflect on actual PCB performance. Solderability test will still a good option if PCBA is expe
Electronics Forum | Fri Oct 15 11:32:04 EDT 2010 | patrickbruneel
Inspecting for plating problems shouldn’t be part of incoming inspection. Your board manufacturer should have the appropriate process control. I shouldn’t have said barrel cracks but plating skips. Plating skips are caused by dull drills or a too hi
Electronics Forum | Thu Oct 14 17:14:22 EDT 2010 | bdavis63
Hello All, I am looking to increase Selective Soldering capability and am looking for insight as to what equipment/manufacturer to persue. I am looking for a small footprint, fully wetted batch system that can be easily upgraded to in line function i
Electronics Forum | Fri Oct 15 16:21:48 EDT 2010 | dyoungquist
Brian When we were looking into getting a selective solder system 2 years ago, I had factory tours at both RPS and ACE. We ended up choosing RPS. Not a big difference between them. The RPS system is a little easier to program in my opinion and wa
Electronics Forum | Wed Nov 10 16:19:51 EST 2010 | davef
The 5 thou standoff of your SOIC is probably the minimum. We wouldn't be surprised to see 10 thou. With this, you could have maybe a 6 thou gap between printed solder paste and the bottom of the heat slug. So, you're expecting the rabbit ears of p
Electronics Forum | Thu Nov 18 16:24:27 EST 2010 | jorge_quijano
Hello, I'm printing adhesive in one of my products using 0603 components, and I'm facing some issues when PCB goes through Wave Solder, I'm checking the right amount of adhesive & termal profile, but missing components still being my headache, I know
