Electronics Forum | Mon Feb 23 16:59:43 EST 1998 | Doug Romm
Dave, "Paladium Pillows and Bad Dreams"....that's a good one! I've been doing this for the last 9 years and I've heard quite a bit, but that's really cute! Seriously, in reference to the 'pillow effect' when the lead looks like it is "sitting" on to
Electronics Forum | Wed Feb 25 16:39:29 EST 1998 | Eldon Sanders
I agree with Chrys, get the spike temp up and wetting is not a problem. However, when the palladium mixes in with the solder the joint will become more brittle. You need to make sure enough solder is printed on the board to minimize the concentrati
Electronics Forum | Tue Feb 24 01:19:01 EST 1998 | Jon Gruett
You are right !!! The exact volume of solder paste onto flip chips is extremely critical. Only one vendor that I know has taken that part of the process to the next level, whereby they can effectively deposit the right amount onto the flip chip exa
Electronics Forum | Fri Jan 16 23:46:38 EST 1998 | Scott
| I have a problem! The solder on my pc boards look great comeing out | of my reflow oven. They go thrue the rest of the prossese | and at the end at the qc station it's cold or whitish or gray not shiny. | does any one have a idea on how to correct
Electronics Forum | Mon Dec 08 14:40:08 EST 1997 | Rin Or
| First Responses Lost: Please Repost | | Looking for info on process flow for 2 sided SMT with PTH | | on the top side. | | Both sides have large SMT ICs. I don't know what the best approach is; | | Epoxy, Paste in Hole, High temp paste. | | Any in
Electronics Forum | Thu Aug 23 11:07:58 EDT 2001 | Hussman
Yup - this is what the homeplate design does.
Electronics Forum | Thu Aug 16 20:01:23 EDT 2001 | davef
Interesting Dano. Tell us more about the variables in your experiment, please.
Electronics Forum | Sat Aug 18 23:43:33 EDT 2001 | CAL
Pin through paste an option?????????????
Electronics Forum | Mon Aug 20 10:57:29 EDT 2001 | Hussman
This connector requires a hole size of 0.055" diameter. A little too large for pin and paste.