Electronics Forum: soldering (Page 1376 of 2103)

double sided reflow

Electronics Forum | Wed Jun 21 22:07:09 EDT 2000 | Jason

We are going to try double sided reflow for the first time. Can we use the same 63/37 paste on both sides? The board also has bare copper pads i'm pretty sure. will this present any challenges? The bottom side has a QFP on it. Should it stay on?

Re: Soldermask Design Rules

Electronics Forum | Thu Jun 15 12:57:12 EDT 2000 | Dave F

0.0006" LT Total pad height = Thickness of ( Copper pad + OSP ) = 0.0014" + 0.00000157" = ~0.0014" (You must be using an organic solderability preservative (OSP) or Electroless Nickel immersion gold (ENIG) because 0.003" tin/lead or white tin would

Re: Cost of solder joint rework

Electronics Forum | Fri Jun 02 16:30:42 EDT 2000 | Michael Parker

I found a reference to Cost of Conversion earlier this year. Basically, the average cost to convert a single component from raw materials to assembled goods is $.08, just after pick and place. After placement and before reflow, repair (solder paste r

Re: intrusive reflow with OA paste

Electronics Forum | Wed May 24 15:28:09 EDT 2000 | John Thorup

Hello Travis I'm going to have to disagree with your evaluation of intrusive reflow. It's not just for low end and,if done correctly, you will not have lots of half soldered leads and touch up will be minimal if at all. I'm sure that others will ag

Re: Rambus

Electronics Forum | Tue May 23 11:06:53 EDT 2000 | Michael Parker

Kathy- Greater than 88%. Is that 3-D Nicolet? I had a conversation with Arline yesterday, she told me about your trials and tribulations with re-balling. I would like to suggest you try micro-stencil instead. If your BGA rework center has the capabi

Re: Where's Earl Moon ?

Electronics Forum | Tue May 09 22:39:55 EDT 2000 | Dave F

Hi Earl ... You movin' to Montana soon? Gonna be a dental floss tycoon, eh? The adverts don't bug me near as much as the weekly "Duh, I've got (you choose): * Solder balls * Tomb stoned caps * Poor soldering with my NC flux ... question from the m

Re: Wave Soldering No-Clean Bottom-Side SMT

Electronics Forum | Tue May 02 05:35:07 EDT 2000 | Donnie

There are a number of different things to ask youreself here. What type of flux are you using. 330, 351, 310 etc. Do you have a hot air knife? As for the residue, that's gonna show on almost any wave soldered pcb. We have fought the issue for a long

Re: BGA Xray inspection

Electronics Forum | Thu Apr 27 21:04:33 EDT 2000 | Dave F

Ron: Good news: Nicolet makes excellent machines. Bad news: I�m unaware of a machine with the capabilities you seek. * X-ray machines lack of resolution needed in relation to the crack geometries encountered within a high density single material.

Re: Open v.s viscosity

Electronics Forum | Thu Apr 20 21:45:10 EDT 2000 | Dave F

Wister: Oooo, I understand now what you mean by "an open." Sorry, I was (am) a bit dense. Your hypothesis is reasonable. On the other hand, have you looked at the traditional causes of tomb stoning also? For a defect to be a "tomb stone," it doe

Convection Oven and thermo profiling of Circuit Boards

Electronics Forum | Mon Apr 17 19:42:34 EDT 2000 | Russ Cutler

We just bought a new Heller 1800 EXL reflow oven for reflowing SMT boards. We us a low temp RMA solder paste with 2% silver. Everything we build is to IPC Class 3 specifications. We have approximately 600 different types of circuit boards we build


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