Electronics Forum | Fri Dec 17 08:05:00 EST 2004 | davef
Your solder paste is talking to you, follow its message. Listen to the paste. Be at one with the paste. If you insist on ignoring the message of the paste, add more paste, if you just need to complete the last board or so, but you really should ju
Electronics Forum | Tue Dec 21 11:46:29 EST 2004 | KEN
Are you adding liquid flux? Or paste "Gel" flux? If liquid flux: This, in my mind, is an unacceptable technique. Why? 1. Can not control metals content. 2. Probably not adding the same chemestry flux...as paste flux has many different addi
Electronics Forum | Mon Jan 03 09:58:29 EST 2005 | Dave J
One of the difficulties with BGA rework is excessive heating of the internal package (die) temperature. We have several "SRT" hot air rework systems which work well, but with Pb-Free components the challenge becomes even greater. The question I have
Electronics Forum | Wed Jan 19 12:34:32 EST 2005 | Robin Daniel
I have an issue where our production team has ran the wrong reflow profile on a no lead product where Indium NC SMQ-230 no lead paste has been used. You can still see the grains of solder after reflow. What I am look for is if anyone has any recomm
Electronics Forum | Tue Jan 25 09:15:02 EST 2005 | Marc A
Good info, thanks for passing along. The company I work for (equipment supplier) ran some tests with lead free material in air and N2 environements for reflow. In the air reflow environement it was noticed that the material does not spread, much li
Electronics Forum | Sat Feb 05 23:54:37 EST 2005 | sms_don
Hello, I found the previous discussion of lead free profiles on 5 zone ovens very interesting. I had the same concerns, but have recently succeeded in creating profiles on a 5 Zone QUAD oven that have eliminated solder splatter or Solder on Gold w
Electronics Forum | Fri Jan 28 12:29:01 EST 2005 | Bob R.
We use the exact same method Chunks outlined for evaluating just about anything we're going to roll out worldwide, whether it's a material or a machine. List your factors (print speed, solder spread, etc), assign each a weight, evaluate each paste a
Electronics Forum | Thu Feb 03 07:39:24 EST 2005 | davef
The component orientation was just for the calculation. It has no affect on what you're seeing. As an alternate explanation, it's possible that difference in temperature is causing the board to flex in the z-direction [as you say, it may not be f
Electronics Forum | Tue Feb 08 10:55:56 EST 2005 | Dreamsniper
Hi, Can you guys give me a heads up on "Traceability". I find it to be a stumbling block in my process and delays my manufacturing throughput big time. I wanna have a clear understanding of when you need it, why you need it and how will you benefit
Electronics Forum | Wed Oct 12 11:19:46 EDT 2005 | patrickbruneel
Yeah, adopting is the right word. In this new lead-free era spec.'s are made to stay within the scoop of the RoHS directive. The driving force for spec.'s should be reliability. Did you see any impurity level spec.'s yet in wave soldering for Cu, Au,
A US manufacturer of quality hand tools for those engaged in the repair, rework, R & D, testing, and assembly of electronic components and printed circuit boards from Through Hole to 2Mil Pitch Surface Mount.
98 Elm St.
Portland, ME USA
Phone: 1-207-775-6139
