Electronics Forum | Wed Dec 24 11:23:22 EST 2008 | childs
I can't seem to locate any information/concerns about moisture entrapment in IC packages on the promary side in a double sided SMT assembly using water soluable solder paste when soldering the second side. A typical process would assemble/reflow/cle
Electronics Forum | Wed Jan 14 18:23:05 EST 2009 | boardhouse
konrad, Here are a couple of things that can affect color. 1) Material color is the major, 2) Matte green from Enthone would be different in shad than Matte green from Taiyo. 3) Solder mask is two parts, One the green mask, two the hardner, having t
Electronics Forum | Mon Apr 06 11:58:42 EDT 2009 | c111
Jeong Ju-young You touched them all up with an iron? Wow! We have also had similar issues. What I did to prove there was a board problem was paste one & reflow one bare board with the same chem (noclean) we saw the non-wetting condition. Then applied
Electronics Forum | Wed Feb 04 09:58:50 EST 2009 | dyoungquist
As was stated before, you need to have oven temperatures (profile) set such that you get good solder joints with the paste you are using. And definately run a profiler through yor oven to verify it is working properly. As for components, most data
Electronics Forum | Tue Feb 10 21:12:08 EST 2009 | smartasp
Dear ALL Thanks for the valuable input so far. The solder results is the first priority whereby the solder paste requirements sets the guidelines for the profile first. We use Kick profiler with the latest software. We verify the oven temp and dist
Electronics Forum | Fri Mar 06 10:46:35 EST 2009 | davef
First, we agree with Loco that your QFP is nonwetting, rather than dewetting. Your sceen-shots look like ol' timey SnPb paste recipes. Turn-up the heaterometer dial. Second, on nitrogen: * We kinda think your O2 needs to be around 100ppm with 99.99%
Electronics Forum | Fri Mar 27 10:04:51 EDT 2009 | ericthered
We have been having problems with proper wetting when running mainly lead free but also leaded solder in our Ersa Hotflow 3. Solder either often looks grainy or doesn't flow over the whole pad. This is generally the case when my profile is 170 firs
Electronics Forum | Sat Apr 04 08:35:27 EDT 2009 | davef
Cause: Solder between the pad and the BGA on the pads being lifted has not melted. So, when you lift the BGA, you also lift those pads with the unmelted solder with the BGA. These pads are probably sinking the heat to a large copper plane in a inner
Electronics Forum | Fri May 22 10:32:51 EDT 2009 | patrickbruneel
By law any forthcoming legislation in this area needs to be in compliance with http://www.nepa.gov/nepa/regs/nepa/nepaeqia.htm This requires an Environmental Impact Report (EIR) be prepared. Such a report has been done by the EPA in 2005 �Solders i
Electronics Forum | Sun Jun 07 09:01:47 EDT 2009 | davef
IPC T-50, Revision H, Terms and Definitions for Interconnecting and Packaging Electronic Circuits, 96.2176 Pad Cratering. A separation of the pad from the printed board resin/weave composite or within the composite immediately adjacent to the pad as
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