Electronics Forum | Tue May 22 10:36:56 EDT 2012 | cbeneat
I can't see the fill as they are underneath the connector. As far as the direction 95% seem to be perpendicular to the wave with the occasional parallel and some all the way around(not many). I have tried altering the speed, I've played with the fl
Electronics Forum | Tue May 22 15:13:27 EDT 2012 | patrickbruneel
good question Reese In addition what type of flux do you use? after seeing the board am pretty sure it's a no-clean but is the flux water based (VOC free) or solvent (alcohol based) Maybe one more question what brand and type of wave machine you use?
Electronics Forum | Mon Jul 02 07:41:08 EDT 2012 | jsolloway
I am going through the process of re-evaluating our AOI systems. Depending on the complexity of your assemblies, I would recommend Mirtec's, and aoi systems as the previous post suggests. Had a demo from them a month or so ago and for the price the
Electronics Forum | Thu Jun 28 16:43:51 EDT 2012 | ssupertuba
Yes I have a KIC and have checked the profile often. I just changed the reel of the parts that are causing problems and it went away. Now what am I suppose to say? I have made an NCMR for the parts but I'm sure they would work in an environment of
Electronics Forum | Thu Jun 28 09:40:49 EDT 2012 | austinpeterman
We just stepped into the inline wash world with a techical devices new clean galaxy plus. We are noticing a significant amount of foaming when washing our boards after selective solder. One theory is that the water soluble flux used is not being cu
Electronics Forum | Fri Jul 06 10:45:02 EDT 2012 | ashworth14
In relation to question 2 the vacume on them is quite sensitive so as long as you bring it down slowly the component is almost sucked up off the PCB so you don't have to actually press it down on the the component, and i have never experienced any so
Electronics Forum | Mon Jul 23 14:44:22 EDT 2012 | hegemon
If your pick and place can handle the part placements, you are most of the way there. X-Ray for Inspection of BGA and other bottom terminations = $60K(USD) and up. BGA Rework Station $40K and up. You can reball most any BGA with your Rework station.
Electronics Forum | Thu Jul 19 18:25:42 EDT 2012 | boriskilk
We have picked up a new customer who is insisting on Ionic cleanliness less than 6.45u grams/cm2 when measured in accordance with OPC-TM-650 Method 3.26.1 with measurements made immediately prior to solder mask application. This is the first request
Electronics Forum | Fri Aug 10 06:40:20 EDT 2012 | thmeier
The unique heat on the PCB is the big advantage and you also can´t exceed the temperature of the boiling point of your medium (we use a 240°C Galden). So small components are not "overheated" until the bigger ones like DPAKS are soldered. You also ne
Electronics Forum | Thu Aug 16 04:35:10 EDT 2012 | craigweir
Can anyone advise on the risks involved in using a (previously soldered) component, in this case an 'SOIC8', as pick-up area for subsequent pick/place operation of sub-assy to larger motherboard ? The sub-assy in question would be a small outline(25
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