 hitech.gif)
Electronics Forum | Wed Sep 03 11:29:09 EDT 2003 | caldon
I think Equipment wise things have changed little. Xray and Endo scopes have seen usefulness with in industry and if you want to add Laser soldering...Well that is some of the new Capital Equipment. Some areas that will grow over the course of some
Electronics Forum | Fri Sep 19 11:49:54 EDT 2003 | chrissieneale
OK, so is anyone qualifying CGA's yet? Our first batch of CGA qualification is not going too well. We stuck with the teardrop shaped pad but the solder fillet is not as big as expected. What size pads is anyone using, i'm getting conflicting informat
Electronics Forum | Thu Sep 25 12:59:14 EDT 2003 | successmani
hi, I am a research student in Electronics manufacturing at RIT. We are planning to assemble boards using lead free solder paste. I was wondering would there be any changes in printing in using lead-free paste"Sn-3.9Ag-0.5Cu". Thedensity of Sn-37Pb
Electronics Forum | Fri Sep 26 08:15:01 EDT 2003 | Gabriele
Forced gas (hot air or N2 according to solder paste or flux) will be the solution. To rework Ceramic (Aluminum lid Heat Sink)BGA (32 mm square ) or Ceramic Colum Grid Array C-CGA 1,25 and 1,00 mm colum (pitch 42,5mm square), also them capped with a
Electronics Forum | Tue Oct 14 23:40:36 EDT 2003 | Dean
Here is a tip. Do an evaluation on materials. DO not trust what anyone says about solder paste. There are just too may "experts" out there peddling the brand of the week. You can begin with the brands listed, but do your homework. You know your
Electronics Forum | Wed Oct 15 12:03:11 EDT 2003 | blnorman
What works in Alaska will probably not work as well in Florida. We have solder paste vendors give us direction with their specific paste, but we also impart our required process parameters on their paste. For instance, here in Alabama in the summ
Electronics Forum | Mon Oct 20 11:48:34 EDT 2003 | blnorman
Who said there was NO evaluation? The paste we chose was evaluated based on a 20 point test score as well as material compatibility. Once we introduced it to manufacturing each line had problems. For one manufacturing treated it as a drop in repla
Electronics Forum | Wed Oct 15 08:55:59 EDT 2003 | John
I'm looking at an application that would require 62/36/2 solder paste. We currently run 63/37. I'd like to change across the board to prevent a mix up, but I don't know what concerns/issues that might create. The PCB's we currently run are HASL fi
Electronics Forum | Wed Oct 29 22:41:42 EST 2003 | msimkin
Our design team have got a problem. We need to either drill out 6 vias/pads for a BGA site, or remove the solder balls form the BGA before they are palced. ( std eutectic) Has anyone used a vendor to remove balls from BGA (0.75mm piutch, ball size ap
Electronics Forum | Tue Nov 11 18:28:18 EST 2003 | Kevin
It sounds to me like Electrovert is a thing of the past. They were bought by a financial clearing house company and were sold because they have been losing money consistently. The new Speedline owners have moved all of their operations to the East
A US manufacturer of quality hand tools for those engaged in the repair, rework, R & D, testing, and assembly of electronic components and printed circuit boards from Through Hole to 2Mil Pitch Surface Mount.
98 Elm St.
Portland, ME USA
Phone: 1-207-775-6139
