Electronics Forum | Mon Jul 16 19:27:27 EDT 2001 | eliishee
I have no choice, as per customer's request to remove the solder balls. Can i use water to clean away the solder ball since i'm using RMA solder paste not the water soluable paste.
Electronics Forum | Mon Jul 16 19:36:09 EDT 2001 | steven
I hv no choice as per customer's request to remove the solder balls. Can i just use water to clean away the solder balls since i'm using RMA solder paste and not the water soluable paste?
Electronics Forum | Mon Jan 17 10:55:44 EST 2000 | Dave F
Interesting point Mark. We prefer solder mask between pads to reduce bridging. How does removing solder mask between pads eliminate solder balling? Thanks Dave F
Electronics Forum | Mon Nov 01 10:16:42 EST 1999 | Mark Anderson
I am interested in getting some feedback on what different companies are doing to eliminate the solder beading issues on 0603, 0402 chip components using a no-clean process. We are currently incorporating a solder mask removal between the solder lan
Electronics Forum | Thu Oct 21 13:53:40 EDT 1999 | John Thorup
Jacob The most comprehensive book on soldering I have seen is Soldering In Electronics by R.J. Klein Wassing and available from Electrochemical Publications in the UK. www.elchempub.com Another is Solders and Soldering by Howard Manko from McGraw-Hil
Electronics Forum | Thu Aug 19 03:09:52 EDT 1999 | Dr. Uwe Weber
we've received an inquiry if lead free solder for solder dips or surface mounting (cream solder) is available on a technical scale
Electronics Forum | Wed Aug 04 15:05:17 EDT 1999 | Tom B.
Hello Netters, Can anyone provide me with info or where to get info on acceptability of solder beads and solder balls? Thanks for any help Tom B.
Electronics Forum | Mon Oct 19 07:48:19 EDT 1998 | Graham Naisbitt
Greg, I may be mistaken but am fairly sure it means Nitrogen or inert gas soldering. Soudage sous azote is French for Nitrogen soldering. Hope this helps Regards, Graham Graham.Naisbitt@concoat.co.uk | Has anybody out there, heard of a process/t
Electronics Forum | Wed Aug 26 06:09:41 EDT 1998 | Wesley Foo
hi, I would like to ask for help if anybody is able to provide any information on the soldering method below. (1)Hot-Bar Reflow Soldering (2)Fiber Focussed IF Soldering. I would really appreciate if you can share with me. Thanks. best rgds..Wesley
Electronics Forum | Tue Feb 17 01:15:26 EST 1998 | J.H Kim
| In solder bumping in flipchip technology by solder printing, | the precise control of solder volume and height is very difficult. | Therefore I'd like to know the solution of this problem. | Thanks
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