Electronics Forum | Wed Sep 01 14:07:41 EDT 1999 | Dave F
| For space contracts we have to mount chip capacitors/ resistors etc 0.1 to 0.4 mm from the pad height. | | This is to compenstae for the CTE differential in the substrate/component and also to ensure cleanliness. | | Does anyone have any new idea
Electronics Forum | Thu Aug 26 08:54:17 EDT 1999 | Dave F
| Having implemented the process of handling moisture sensitive devices our logistics department tries to classify all parts according to their moisture level. | Going through datasheets wasn�t that helpfull, so does anyone know of a source for that
Electronics Forum | Tue Aug 24 04:05:15 EDT 1999 | Scott Davies
| Hello everyone, | We found many cylindrical diodes missing during SMT process. Could someone tell us how to prevent this problem? Is it effective to change the shape of stencil apture or reduce fan speed in reflow oven? Thanks in advance. | | Gyve
Electronics Forum | Sat Aug 21 12:38:09 EDT 1999 | Earl Moon
| Want to know the Tools/ Process required to get started with CSP prototyping and R & D. | Anyone working on this , please help out. | Depending on the type, size, and pitch - just like BGA's, they aren't tough. Our 1mm types went through prototypi
Electronics Forum | Fri Aug 13 13:38:23 EDT 1999 | Bian Wycoff
| Has anybody adopted the method of stencil printing with the board at a 45 degree angle to the squeegee blade? What are the benefits and drawbacks? I've heard you get better fine pitch results. | | TX | Mark | I have used thetechnique extensiv
Electronics Forum | Fri Aug 13 09:51:25 EDT 1999 | Dave F
| Ladies and Gentlemen, | | As a newly appointed DFM/CE "guru" here, one of my responsibilities has become repair (of course). As I have some knowledge of BGA repair/rework using semi-automated equipment, it naturally follows I would hav tremendous
Electronics Forum | Fri Aug 13 12:52:17 EDT 1999 | Steve Schrader
| Hello | | Having a problem with bridging on 20mil pitch qfp, only on the lead groups where squeegee goes over width of apertures. Using MPM sp-200 semi-auto, chem-etch stencil, 9-10mil width opening | 100 durometer blade. Getting "tails" on deposi
Electronics Forum | Thu Aug 19 19:10:31 EDT 1999 | Brian Wycoff
| | | | Hello, | | | | | | | | Can any netters suggest what critical parameters should be considered & what are there assoicated impacts for a solder paste printing process ... | | | | | | | | B.Regards, | | | | Felix | | | | | | | I have a proce
Electronics Forum | Tue Aug 10 13:05:57 EDT 1999 | ScottM
| Folk's, | | I'm looking for some helpful suggestions for reworking wave soldered bottomside components that have been glued. | I'm not a fan of the twist and break approach and as some of them either have a double dot or a slot configuration this
Electronics Forum | Wed Aug 18 15:52:21 EDT 1999 | DENNIS FOWLER
| | | Gian | | | | | | You alarm me when you talk of white residues in a "no-clean" process. This should not happen. It sounds like you have compatibility problems between different residues and/or a poorly polymerised solder mask. | | | | | | Ther
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