Electronics Forum | Sun Jul 26 17:13:31 EDT 2009 | slthomas
Is it possible that the assembler is using solder wire that's too small for the application and feeding it too quickly to compensate?
Electronics Forum | Thu Sep 10 15:10:12 EDT 2009 | mefloump
This has some good iinformation for wave solder defects... http://www.trafalgar2.com/troubleshooter/wave_soldering.htm
Electronics Forum | Tue Aug 25 13:30:35 EDT 2009 | rossi
It appears that the crack is between the paste and the ball. We physically pulled off the BGA by force and almost all the balls broke at the PCB. There was a thin layer of solder left on the pad. Maybe 1% of the balls stuck to the pad. I have attac
Electronics Forum | Mon Aug 24 11:41:41 EDT 2009 | tds
I rebuild solder recovery systems that are used during the dedrossing of solder machnes. My number is 330-724-3333. We have sold a lot of these machines and have plenty of references. Scott Wilson
Electronics Forum | Tue Sep 01 11:05:36 EDT 2009 | saisungold
We gold plated PCB and while soldering, the adhesion of soldering is not uniform at the tips(soldering ends). Please help us to solve the problem.
Electronics Forum | Tue Sep 22 10:05:00 EDT 2009 | roland_grenier
Does anyone know how to calculate solder paste volume required to run a PCBA on an SMT line? I'm looking for a solder paste volume model which include paste waste. Roland
Electronics Forum | Fri Oct 23 14:20:52 EDT 2009 | waveroom
We offer SN100C solder alloys. I was asked about SN100E which is tin/copper and cobalt. Anyone know anything about the cobalt and it's pros and cons in soldering process?
Electronics Forum | Thu Nov 19 10:32:32 EST 2009 | jrr3434
Can anyone tell me if there is a volume difference between a pound of lead vs. lead free solder? Does lead free solder attack stainless or castiron when it's not molten? Thanks. Jay
Electronics Forum | Thu Dec 24 10:34:51 EST 2009 | davef
isd.jww: First, the original poster is talking about pads, not component leads. Second, you're correct that chrome plated component leads can be attached by spot welding or crimping a solderable tab to the lead and then soldering the tab to the boa
Electronics Forum | Fri Dec 25 08:39:48 EST 2009 | davef
Compared to 63/37, solder with high tin content: * Requires higher reflow temperatures * Demands tighter process control * Results in duller, more grainy looking solder connections Tell us about the specific problem that you seek help in solving.
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