Electronics Forum | Mon Dec 04 21:36:13 EST 2006 | davef
For ppm data look here: http://www.ppm-monitoring.com/
Electronics Forum | Tue Jul 31 17:11:28 EDT 2007 | rpadilla
Is the via hole not supposed to be there, or is this by design? If you are trying to fill the via hole with solder and not have voiding issues, I suggest using a type 4 solder powder mesh size. Reason being, anytime you go beyond Type 4 mesh, to so
Electronics Forum | Tue Jul 31 18:33:53 EDT 2007 | mattkehoe
http://www.sipad.com/sipad_vip.htm
Electronics Forum | Sat Aug 04 07:44:25 EDT 2007 | davef
Thermal cycle* * Requirements for and troubleshooting of poor barrel fill => Hole fill
Electronics Forum | Tue Aug 28 16:30:24 EDT 2007 | shrek
thats goofy
Electronics Forum | Mon Sep 10 15:30:29 EDT 2007 | davef
See there Mr. Smartbutt, you were correct in spite of your more cynical tendancies. B)
Electronics Forum | Mon Sep 10 18:04:28 EDT 2007 | slthomas
How are you attaching your thermocouples to measure the temperature of the lead/pad connection?
Electronics Forum | Tue Sep 25 14:43:28 EDT 2007 | mun4o
Hi, we change Kester with Interflux and all it is OK.The problem was paste Regards
Electronics Forum | Mon Jan 07 12:50:28 EST 2008 | realchunks
OK, I'll venture to ask..... why not use a reflow oven. Not as cool as lasers, but just as effective.
Electronics Forum | Mon Jan 07 13:54:55 EST 2008 | fsw
I agree with Chunks! Why consider laser sodlering when u can reflow!
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