Electronics Forum | Mon Nov 06 21:06:13 EST 2000 | Dave F
Thomas: Wheeee, a 40% failure rate. Now, that make your boss chase you around the room won�t it? As you indicated, x-ray won�t do dip about helping to identifying problems [or ball cracks either]. Consider using an ERSA scope [er whatever they ca
Electronics Forum | Wed Jan 17 03:35:07 EST 2001 | Arul
We have few failures similar to the discussion in this thread, on a 50 Mil pitch, 30 Mil mill Ball PBGA. Would like to understand the mechanism of the BGA reflow process bit more. Appreciate your response to the following. 1.We sheared few solder ba
Electronics Forum | Wed Aug 30 16:00:42 EDT 2000 | Dave F
Russells: You can mix the two solders you mentioned, assuming by "96s" you meant "96Sn / 4Pb". If you heat the two tin / lead alloys to a liquid state, you�ll form a tin / lead solution with properties different from either of the two solders. The
Electronics Forum | Mon Aug 07 14:02:54 EDT 2000 | Brian W.
If you are satisfied with the apertures, then you need to check placement pressure, plant humidity, and the reflow profile. If the placement pressure is too great, it will separate minute portions of the solder from the pad. When the solder reflo
Electronics Forum | Thu Jun 29 11:08:55 EDT 2000 | Dave F
Kok Han: Good to hear from you. Please help us understand you situation better by talking more about: � Component IC of the RF unit (IC101). For instance: SMT / PTH, package, pitch, lead material, lead finish, package type, package weight, coplan
Electronics Forum | Tue Mar 21 20:33:09 EST 2000 | Dave F
Shane: We don�t dispense, but we have thought about it. Several points about peelable solder masks in a no-clean (low residue) process: � Beware of latex peelable solder mask with a low res process without extensive testing. The problem is usuall
Electronics Forum | Thu Feb 15 23:52:31 EST 2001 | Dreamsniper
Hey guys, I ran a couple of profile in our wave solder machine using wave optimizer and this is what i got: Parallelism = 0.0 Immersion Depth = 2.1mm to 2.4mm with varying immersion time from 1.1 sec to 3.1 secs. Contact Length = between 5.0 to 6.0
Electronics Forum | Thu Mar 22 17:38:44 EST 2001 | davef
OK, lemme take a different angle on this, �cuz I forgot to touch on this when I first responded. I mentioned a study ["Evaluation of Low Residue Soldering for Military and Commercial Applications: A Report from the Low-Residue Soldering Task Force"
Electronics Forum | Thu Aug 24 09:23:29 EDT 2000 | Dr. Ning-Cheng Lee
You are asking a very good question which has been an issue in the industry for a long long time. For operating at 225C, you will need a solder with melting point no lower than 270 or even 280C. HMP solder is very difficult to come by. At this stage,
Electronics Forum | Mon May 14 17:14:07 EDT 2001 | davef
First, consider checking the fine SMTnet Archives. Look for threads on "white tin", in addition to "immersion tin". We�ve had a cuppla good ones of late. Merix [http://www.merix.com] gives a good comparison of different solderability preservatives
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