Electronics Forum | Mon Nov 25 07:58:27 EST 2002 | Yannick
Hi, I made a board wich I plated with immersion Tin, I tought it should be the same result as we had with tin lead but we ran into a weird problem. WE use a 63/37 no clean paste and on the Board with Immersion Tin the solder just make a ball ON
Electronics Forum | Mon Nov 25 09:06:15 EST 2002 | jax
You might want to check the tin thickness. I believe you have a minimum of .65 microns in order to achieve a good solder joint through 3 thermal passes. In an immersion tin process, the ability to solder is time and temperature dependant. As the int
Electronics Forum | Mon Jan 13 18:22:55 EST 2003 | davef
100 sec) and decrease reflow temp to 205C. * Understand that voids are primarily process indicators. There is experimental evidence that voids retard crack propagation locally around the void on a temporary basis. There is no standard, IPC or otherw
Electronics Forum | Fri Jan 24 16:46:21 EST 2003 | MA/NY DDave
Hi, Distance Engineering is always difficult. I am guessing that the old machine and process ran wonderfully / acceptable. If you still have the old machine, how about running an empty board through it and then the new machine. Without flux observ
Electronics Forum | Sat Jan 25 20:17:40 EST 2003 | ramanandkini
We are soldering a 8 pin TTL chip on to a CEM1 board that has a hot air level soldering. We use no clean soler paste for the reflow process. Now the customer wants us to clean since he is afraid of flux attracting the dust. We have some SMT LEDs that
Electronics Forum | Wed Feb 05 13:08:20 EST 2003 | joeherz
You're correct that a thicker solder deposit will make bridging on fine pitch devices a bigger risk. Another alternative could be to slightly over-print the pads (onto the soldermask) ala pin-in-paste process. Basically adding enough solder to fill
Electronics Forum | Mon Feb 24 10:21:29 EST 2003 | ryanm
Just an update on my problem. I spoke to Loctite and they had very few solutions. One thing they suggested to try was to add a thirty-second soak time at 150 degrees to my reflow profile. The problem with that is ramp-soak-spike profiles doesn�t s
Electronics Forum | Fri Feb 28 08:57:34 EST 2003 | davef
We used to bake [100*C for 6 hours] all of our boards, but no longer bake at all. Before going off, your bake recipe is probaly OK. If anything, it's probably too short. Consider measuring the weight of wet boards, baking for a time, measure, bake
Electronics Forum | Wed Mar 05 05:29:49 EST 2003 | Matherat
Our company does not assemble boards but our customers do and 2 side smd with through hole is pretty common in our experiences.Our customers usually have already decided to glue the bottom side components and fuse them during the wave solder process.
Electronics Forum | Sat Mar 08 11:04:47 EST 2003 | Joe
Mark, You've already received some good advice from the other posters. The one thing I would add is that even if you solve your printing issues on this type of part, the relative small quantity of paste may be prone to soldering problems. Ever s
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