Electronics Forum | Fri Jul 30 20:27:49 EDT 1999 | Dior
Has anyone done the research on BGA pad size? suppose I have a 0.030" diameter pad as recommended pad size from the spec, what will the minimum pad size allowed? We are laying out a high density board.
Electronics Forum | Sat Jul 31 13:27:42 EDT 1999 | Miguel Mariscal
| Has anyone done the research on BGA pad size? suppose I have a 0.030" diameter pad as recommended pad size from the spec, what will the minimum pad size allowed? We are laying out a high density board. |
Electronics Forum | Thu Jun 03 14:54:11 EDT 1999 | DWR
Has anyone had a problem with the trailer tape length being too short and causing placement machine to stop for parts exhaust (SMT parts)? I realize the EIA spec. is set for this length but would like to know what issues you have had. Thanks
Electronics Forum | Fri May 21 11:39:07 EDT 1999 | Robert Cass
Does anyone know were I can find acceptable board scoring specification for V scoring of board break aways. I was unsuccessfully in finding the information in IPC specs..
Electronics Forum | Fri May 21 12:14:28 EDT 1999 | Dave F
| Does anyone know were I can find acceptable board scoring specification for V scoring of board break aways. I was unsuccessfully in finding the information in IPC specs.. | try this:
Electronics Forum | Wed Feb 24 07:56:53 EST 1999 | Brian C
Under IPC-A-610 Section 10.3(Components on their sides) it reads: ______________________________________________________ Acceptable - Class 1,2 Nonconforming Defect � Class 3 Chip components on its side provided the following are met: Chip
Electronics Forum | Wed Feb 24 10:56:12 EST 1999 | Steve Schrader
| Under IPC-A-610 Section 10.3(Components on their sides) it reads: | ______________________________________________________ | Acceptable - Class 1,2 | Nonconforming Defect � Class 3 | | Chip components on its side provided the following | are
Electronics Forum | Thu Dec 17 14:47:24 EST 1998 | Dave F
| What is the CPH for Universal/Sanyo chip shooter? Spec. needed only. Thanks | Mike: Universal�s High Speed Placement (HSP) machines are booked at: 4791 - 30k cph 4796 - 36k cph
Electronics Forum | Wed Sep 30 13:42:56 EDT 1998 | Chrys
Hello, I've been evaluating a bunch of wave solder fluxes and found one that is absolutely perfect. I'm so excited I can't wait to switch over. Unfortunately, I have to assure reliability, and the only test I have in-house is ionic contamination
Electronics Forum | Tue Jun 23 12:21:51 EDT 1998 | Robert Cass
We have a need to manually insert, cut and clinch a radial part that is prep close to spec on a board traveling down a standard conveyor. Is anyone aware of such a system? I only know of regan off line.
