Electronics Forum: specification (Page 171 of 281)

Re: Help for choice

Electronics Forum | Mon Jul 17 20:20:53 EDT 2000 | Dave F

There is a wide range of price points and configurations for such equipment. RFA (Read the Fine Archives) and contact the suppliers (supplier lists are in SMTnet and "SMT" & "Circuits Assembly" etc magazines) and get back to us with specific question

Re: Gold Fingers Discoloration

Electronics Forum | Wed Jul 05 17:06:36 EDT 2000 | Michael Parker

Patrick- You have not given enought detail of the type of discoloration. Is it "white residue"? Can it be "rust" colored? Whatever it is, you fab supplier needs to be called in immediately and give you an exact reason for this failure. Just rubbing

Re: Underfilled CSP mechanical test

Electronics Forum | Mon Jun 19 21:32:15 EDT 2000 | Dave F

Frank: Good luck on finding a specification. The right combination of material properties will greatly improve the lifetime of your flip chip component. Your flip chip supplier might be best starting place to determine underfill properties that ma

Re: Info on Universal Instruments?

Electronics Forum | Thu Jun 08 21:14:31 EDT 2000 | Thomas Ravener

You asked about info on a line. The only responses have been on a single machine. What type processes are involved? Are you doing a mixed technology application? UIC has probably one of the best technology application labs in the business. But all of

Re: Can't identify a part

Electronics Forum | Thu May 25 17:41:29 EDT 2000 | John Thorup

Hello Jason Sorry that I can't be of much help as your part seems to be proprietary to a specific OEM manufacturer. I would guess that it is a Temperature Compensated Crystal Oscillator by the TCXO and the shape. This is basically a precision cryst

Re: Vectra Wave

Electronics Forum | Fri May 05 14:30:11 EDT 2000 | C.K.

I'd have to disagree with the Electrovert applications guy. I'd recommend SLOWING down the conveyor between .5 to 1 FPM - effectively, you're REDUCING contact length (because contact length = dwell time * conveyor speed), hence getting better peel-o

Convection Oven and thermo profiling of Circuit Boards

Electronics Forum | Mon Apr 17 19:42:34 EDT 2000 | Russ Cutler

We just bought a new Heller 1800 EXL reflow oven for reflowing SMT boards. We us a low temp RMA solder paste with 2% silver. Everything we build is to IPC Class 3 specifications. We have approximately 600 different types of circuit boards we build

Re: Convection Oven and thermo profiling of Circuit Boards

Electronics Forum | Tue Apr 18 19:37:35 EDT 2000 | Russ Cutler

Let me be more specific about my dilema. We have used a vapor phase reflow process for many years. We just bought a Heller 1800 this year (2000). We may very well be able to run all 600 very different board types we build in 10 recipies on the Hel

Re: Convection Oven and thermo profiling of Circuit Boards

Electronics Forum | Wed Apr 19 14:07:20 EDT 2000 | Russ Cutler

Let me see if I've got this straight...rather than hook up a MOLE or a KIC profiler to each and every board (600 P/N's in my case), most people are making judgement calls based solely on how similar a board looks to another board, for which they have

Re: Paste Tack Time

Electronics Forum | Fri Mar 24 10:26:45 EST 2000 | Russ

Sal, Interesting problem, I have found that W.S. pastes tend to have a shorter tack time in real life than what is advertised. Usually the manufacturers specify tack time as after placement let the board sit and then turn it upside down and see if


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