specification

"specification" search results in the Electronics Forums



2654 results found for "specification" in the Electronics Forums

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no-clean flux removal

Jan 20, 2005 |

Undersized Land Width from PCB Fab - Help!

Nov 9, 2004 | Your board fabricator is: * Correct that +-20% is the tolerance of the IPC specification * A moroo

Max temp on a lead free part

Oct 18, 2004 | I have two industry leading customers that have specific requirements for components to survive 30 s

Looking for small Dishwasher type cleaning

Sep 2, 2004 | Silverado, To answer your specific question, there are several manufacturers of batch-format clea

Good Profiler for reflow ovens

Aug 17, 2004 | Well, regarding the paste specifications, it's no problem to add yours if it's not allready defined

Solid Solder Deposit

Aug 9, 2004 |

Exactly.

Jul 30, 2004 |

Electromigration Testing

Jun 30, 2004 |

Can a GSM place 0201's

Jun 16, 2004 | Greg, Just to cover the formalities, I work for Universal, and specifically with the GSM Platfor

contaminated components

May 10, 2004 |

Moisture Sensitive Devices

May 6, 2004 | Intel is very specific in their recommendations regarding moisture sensitivity.Check ou the followin

Oxidation on BGA

Apr 20, 2004 |

Cygnal's MLP-11 Package

Mar 31, 2004 | We have not used this specific package. We agree on your toe fillet idea. Toe fillets add no str

QFP Removal

Feb 17, 2004 |

SMPI-->SMEMA

Jan 23, 2004 |

HSP 4792 dull cutters

Dec 31, 2003 |

need all

Dec 22, 2003 |

Re-Reflowing PCB's

Oct 13, 2003 |

Screen washing

Aug 27, 2003 |

Voids in solder fillet

Apr 17, 2003 |

BGA attach eval.

Apr 2, 2003 |

Print-Glue-Wave process

Mar 13, 2003 |

Tact Time Estimates

Mar 10, 2003 |

Print process capability

Mar 3, 2003 |

PWB Fabricators

Jan 24, 2003 |

BGA PCB Pad size

Jan 17, 2003 |

0603 - stencil thickness

Jan 3, 2003 |

Screen Printers

Dec 3, 2002 | Hi Brad, Before I tell you my glove fits your hand, I'd like to see your hand. More specifically I

Intrusive Reflow

Dec 2, 2002 |

Board with immersion Tin

Nov 25, 2002 |

type 4 paste & type 5 - environment factors & process parameter?

Nov 13, 2002 | does anyone know what environment factors(specifications?) and process control parameters(printer &

specs or guidlines for how many times you can rework a bga site

Oct 15, 2002 | First, this is a very interesting question. Second, there is no specification. Third, companie

Flying Probe Probe Tester with AOI

Large PCB Dispensing System