Electronics Forum: specification (Page 256 of 281)

Process control, SMT inspection and rework

Electronics Forum | Tue Apr 09 15:24:29 EDT 2002 | Alan W.

I have recently signed onto a company with very little board assembly experience. I am trying to develop a process control and continuous process improvement program for a new surface mount line, but have run into several people who are not really i

Moisture Barrier bags

Electronics Forum | Fri May 03 10:51:24 EDT 2002 | fmonette

Dave is correct. I am including additional information that comes from a recent posting on another industry forum : The proper guidelines for bag sealing are actually specified in the JEDEC standard EIA/JEP124 section 5.2.1 Packing moisture-sensiti

How to run SMT production with low defects

Electronics Forum | Thu Aug 15 15:44:46 EDT 2002 | dragonslayr

You can't control what you don't measure. You have provided very little detail other than post reflow costs are high. What defects are attributed to problems experienced prior to reflow? Are these random or recurring defects? You will need to put ea

Solder mask registration

Electronics Forum | Tue Oct 01 10:47:45 EDT 2002 | davef

Board fabricators purchase laminate in preferred panel sizes, such as: 16 x 18 inches, 18 x 24 inches, and 21 x 24 inches. A larger panel size provides more effective cost per unit area processed. In producing a board, the fabricator requires maybe 3

two-sided design guidelines

Electronics Forum | Fri Oct 18 09:50:02 EDT 2002 | russ

Steve, I am not aware of any standards so to speak. But IPC 782 and 770 have some useful info regarding mounting and pad geometries for wave etc... Since I do not know what type of components you will be wave soldering I will just give you some

Rep Responses in Forum, Possible Guidelines

Electronics Forum | Thu Oct 10 15:56:14 EDT 2002 | seand

Hello Everyone, It has been my perception that one of the long time issues in Forum has been the code of conduct with regards to Rep responses (I know...Duh). I tried looking through the site to look into a possible defined protocol and didn't find

IONIC CLEANLINESS SPEC FOR BARE PWBs

Electronics Forum | Fri Dec 06 12:24:03 EST 2002 | Mike Konrad

Military and most commercial standards requires post-soldered boards to measure less than 10 �g/in of NaCl (14 when using an Omegameter, 20 on a Ionagraph, and 37 on a Zero-Ion). As Dave stated, 6.5 �g/in of NaCl is called out in Mil-P-55110 for ba

Flex Circuits reflowing

Electronics Forum | Fri May 02 16:58:39 EDT 2003 | swagner

We have been building with flex circuits for nearly three years now, its an automotive product utilizing lead free paste, I will give you a few pointers. 1. Evaluate your supplier carefully, make sure you have some kind of stretch tolerance on the p

Acqueous Cleaning of RMA Flux

Electronics Forum | Wed Sep 10 11:57:14 EDT 2003 | Mike Konrad

First, you must determine a few things: 1. What specific de-fluxing chemical are you going to use? Basic required determinations include the chemical�s pH, is it a VOC (if so, what is its VOC content), what concentration is the chemical used in (1

Reflow profile basics

Electronics Forum | Wed May 12 16:31:25 EDT 2004 | Mark @ SolderStar

In answer to your questions. (1) pls can any body throw some light on the reflow profiling? Reflow profiling is the process of confirming that you PCB's that pass through your reflow oven are produced within specifications provided by solder paste


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