Electronics Forum | Fri May 10 17:42:55 EDT 2002 | davef
I don't know �solder ballooning� from a shoebox. So, rather than let this degrade solely into a rant about the evils of via in pad, please get me up-to-speed in jargon.
Electronics Forum | Wed Jun 05 09:26:08 EDT 2002 | stevel
Hello, everyone. We are checking a Panasonic Soft Beam machine. Did any one has expenience on Panasonic's softbeam machine - soldering performance, solder speed, easy to access? Anything would helpful. Appreciate your help.
Electronics Forum | Fri Jul 26 00:04:37 EDT 2002 | Dick Toftness
Juan, Agilent Technologies (my employer) has just announced a new high speed paste measurement system called the SP50. If you are interested contact an Agilent Sales Office.
Electronics Forum | Tue Jul 30 17:45:56 EDT 2002 | davef
What's this 'metalic coating on both sides'? Is that like a 'two-sided board'? I expect that your 200�F is the primary side temperature just prior to entering the wave. If not, you need more juice [depending on your flux and all that]. [Some mode
Electronics Forum | Thu Aug 01 07:51:04 EDT 2002 | GregH
Are all components calculated at the same cost when calculating cost per placement? Are they categorised according to their sizes / dimensions as per machine placement speed or are they also categorised as per component technology? Can anyone give m
Electronics Forum | Mon Dec 16 17:38:56 EST 2002 | davef
Baking boards in a nonvalue added activity. Quit doing it!!! As a routine production activity, it is either: * Totally unnecessary ... OR * Band-aid to cover for problems in fabrication, purchasing, or storage methods. Search the fine SMTnet Archi
Electronics Forum | Mon Dec 23 17:20:05 EST 2002 | davef
Try: * Prebake * Flux density * Conveyor speed * Upper preheat * Cooling time * Chip wave * Solder temperature You could add immersion depth (1/3 to 2/3 of the board) to convince yourself that it has the least impact of any variable in wave solderin
Electronics Forum | Sat Mar 01 08:21:04 EST 2003 | davef
There are some fairly painless bare board fabrication methods that you can do in-house. Their main benefit is speed of respnse and schedule control. Profitability would depend on loading, marketing, and stuff like that.
Electronics Forum | Thu Mar 27 11:49:18 EST 2003 | kenlchin
In printing,the thickness of solder paste perpendicular to the Squegge direction is always lower 1 mil than that parallel to the Squegge direction,so Insufficient Solder may occur.I think you may slow printing speed or widen appertures to resolve it.
Electronics Forum | Wed Apr 16 07:31:45 EDT 2003 | brobinson
Anybody know a site that lists example oven profiles? I am looking to write a profile for 120 C for 15 minutes through a Vitronics Soltec XPM Reflow oven. Rather than guess, a rough starting time for belt speeds would be nice.
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