Electronics Forum | Sat Feb 10 17:12:03 EST 2001 | rpereira
I admit, 16 mil QFP printing is very challenging but if all your control factors (print speed, etc...) are setup correctly (through DOE) extremely high yields can be achieved and more importantly a repeatable and robust product will be manufactured.
Electronics Forum | Sat May 12 00:04:36 EDT 2001 | zam_bri
The product I'm running currently consist a mix of 20 mil pitch QFP, 50 mil pitch, 0402, BGA and variable size of connectors from small to big, on OSP finished PCB. Running intrusive reflow with a mix packages is a real headache, esplly when you hav
Electronics Forum | Thu Jun 24 23:52:36 EDT 1999 | Dean
| | | Dear guys, | | | | | | I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thickness. We
Electronics Forum | Thu Jun 17 21:24:32 EDT 1999 | Dean
| first of all what is the technical term for the small amount of solder on a plated pad. we are getting poor screen printing gasketing on a 20 mil qfp due to this solder not being even or too high in spots and not covering the length of the pads. an
Electronics Forum | Fri Jun 18 11:33:16 EDT 1999 | Brian wycoff
| | first of all what is the technical term for the small amount of solder on a plated pad. we are getting poor screen printing gasketing on a 20 mil qfp due to this solder not being even or too high in spots and not covering the length of the pads.
Electronics Forum | Sat May 01 09:55:59 EDT 1999 | Bob Willis
| Hi all, | | We're starting up tests for pin-to-paste and, well, things could be better. We're testing different pastes and we're testing different apertures rules and, well, we're still testing. It's coming close and we're getting pretty good
Electronics Forum | Fri Dec 18 10:18:55 EST 1998 | Dave F
| I have been developing a BGA Process and are having problems with a 310 IO PBGA reflowing. I am achieving good wetting exept 2 to 5 balls on the outer perimeter I have a good profile my air flow is set per mfg spec, the strange thing is that it doe
Electronics Forum | Wed Dec 23 11:11:07 EST 1998 | john watt
| | I have been developing a BGA Process and are having problems with a 310 IO PBGA reflowing. I am achieving good wetting exept 2 to 5 balls on the outer perimeter I have a good profile my air flow is set per mfg spec, the strange thing is that it d
Electronics Forum | Mon Nov 16 12:41:46 EST 1998 | MMurphy
| | | | | I keep hearing about polyimide stencils, but what are they like in terms of registration and aperture accuracy? | | | | | | | | | Fraser- | | | | | | | | We use polyimide stencils with great success for our prototype boards. They are
Electronics Forum | Wed Nov 18 18:10:16 EST 1998 | fraser
| | | | | | I keep hearing about polyimide stencils, but what are they like in terms of registration and aperture accuracy? | | | | | | | | | | | Fraser- | | | | | | | | | | We use polyimide stencils with great success for our prototype boards.
