Electronics Forum | Thu Dec 08 07:55:16 EST 2005 | davef
Your understanding of the situation is correct. In both cases, you solder to the nickel. The gold [Au] protects the nickel from oxidation. When soldering, the gold moves into solution in the solder and forms an intermetallic compound [IMC] with th
Electronics Forum | Wed Feb 22 08:31:42 EST 2006 | davef
Q1 Are there any standard regulating the subject? Very few infos found on IPC. A1 We�re unaware of standards for packing and storage for most types of boards. * IPC 4553 standard for Immersion Silver Finish, 3.8 Packing and Storage. * J-STD-033 and E
Electronics Forum | Thu Mar 23 22:26:53 EST 2006 | Joseph
Dear all, Referring comment from Mr. Jack,IPC director certification & assembly technology, the term "fillet tearing" is too broad. Cracks or fractures in the required fillet area, with SnPb or LF alloy and whether you call it tearing or not, is a D
Electronics Forum | Tue Aug 22 13:05:32 EDT 2006 | Board House
Hi CP, From a PCB manufacturing side, all of our product is Lead free / RoHs compliant if it has a surface finish other than Hot Air. To be ROHS compliant and Able to with stand Lead Free Assembly, this is where the board house would need to switch
Electronics Forum | Tue Jul 17 21:48:09 EDT 2007 | davef
Per ESD Handbook TR 20.20 paragraph 5.3.15 Humidity "Humidity is beneficial in all ESD Control Program Plans. Contact and separation of dry materials generates greater electrostatic charges than moist materials because moisture provides conductivity
Electronics Forum | Thu Sep 29 10:21:11 EDT 2011 | davef
1. Floor loading requirement - The designer of your factory building specified the flooring with a certain floor loading capability. You need to determine that capability. You plan to install machines and equipment. You need to determine the weight o
Electronics Forum | Tue Jan 10 16:01:20 EST 2017 | davef
A review document for J-STD-001F with Amendment 1 had the following wording, but you should check the actual document to be sure of correctness 4.2 Facilities Cleanliness and ambient environments in all work areas shall [D1D2D3] be maintained at le
Electronics Forum | Sun Sep 02 09:06:42 EDT 2018 | davef
Cold resistance between the tip of the tool and the ground reference, tip current leakage, and tip voltage. per ANSI ESD STM 13.1 J-STD-001 Rev G, Appendix “A” Guidelines for Soldering Tools and Equipment: A-2 BENCHTOP AND HAND SOLDERING SYSTEMS Se
Electronics Forum | Mon Jan 08 20:57:52 EST 2001 | Dave F
Are you talking about bare board cleanliness or assembly level cleanliness? Bare board cleanliness is still primarily measured by resistivity of solvent extract (ROSE) using instruments such as Omegameters and Zero Ions. What is considered as "acce
Electronics Forum | Wed May 03 20:04:21 EDT 2000 | Dave F
Joe: Hey, just hose everyone down with water when your humidity starts to decrease to below 40%. ;-) Actually, that�s how some humidity controllers work, when added to your heating system. Well basically that�s how they work. I�m not tryin� to
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