New Equipment | Solder Materials
WP616 is a zero-halogen, lead-free, water-soluble solder paste formula for both nitrogen and air reflow applications. WP616 provides a combination of consistent print performance at wide humidity levels, excellent solderability and ease of cleaning,
New Equipment | Test Equipment
Measuring Materials "in situ" (i.e. while in use) Take control of the materials in your facility with Insituware’s Vision MARK-1 hand-held diagnostic tool. The Vision product family uses machine learning technology to bring material
Electronics Forum | Thu May 11 11:25:56 EDT 2017 | davef
Key to Rosin Fluxes [from SUPERIOR FLUX & MFG. CO.] Type R (Rosin): Non-activated rosin flux for soldering copper. Residues are non-corrosive and non-conductive. Type RMA (Rosin Mildly Activated): Mildly activated rosin flux that contains no chlori
Electronics Forum | Mon Dec 20 10:20:14 EST 2010 | 18424
Test Resistance to ECM shall be 65C +- 2C @ 88.5% +- 3.5% All SIR Measurements shall not exceed 100 MOhm. I am not sure of voltage.
Industry News | 2009-04-15 23:12:38.0
BANNOCKBURN, Ill., USA, April 1, 2009 � IPC � IPC � Association Connecting Electronics Industries� presented Special Recognition, Distinguished Committee Leadership and Distinguished Committee Service awards at IPC APEX EXPO 2009, held March 31�April 2 in Las Vegas.
Industry News | 2012-02-28 14:00:06.0
IPC presented Presidents, Special Recognition, Distinguished Committee Leadership and Committee Service Awards at IPC APEX EXPO® at the San Diego Convention Center.
Technical Library | 2017-02-09 17:08:44.0
The SMT assembly world, especially within the commercial electronics realm, is dominated by no-clean solder paste technology. A solder paste flux residue that does not require removal is very attractive in a competitive world where every penny of assembly cost counts. One important aspect of the reliability of assembled devices is the nature of the no-clean solder paste flux residue. Most people in this field understand the importance of having a process that renders the solder paste flux residue as benign and inert as possible, thereby ensuring electrical reliability.But, of all the factors that play into the electrical reliability of the solder paste flux residue, is there any impact made by the age of the solder paste and how it was stored? This paper uses J-STD-004B SIR (Surface Insulation Resistance) testing to examine this question.
Technical Library | 2017-07-13 16:16:27.0
Controlled humidity and temperature controlled surface insulation resistance (SIR) measurements of flux covered test vehicles, subject to a direct current (D.C.) bias voltage are recognized by a number of global standards organizations as the preferred method to determine if no clean solder paste and wave soldering flux residues are suitable for reliable electronic assemblies. The IPC, Japanese Industry Standard (JIS), Deutsches Institut fur Normung (DIN) and International Electrical Commission (IEC) all have industry reviewed standards using similar variations of this measurement. (...) This study will compare the results from testing two solder pastes using the IPC-J-STD-004B, IPC TM-650 2.6.3.7 surface insulation resistance test, and IPC TM-650 2.3.25 in an attempt to investigate the correlation of ROSE methods as predictors of electronic assembly electrical reliability.
