Electronics Forum | Thu Jul 16 16:56:02 EDT 1998 | Doug Nebel
| Howdy 2, | I am using my first DEK GSX PRINTER. Looks and acts good so far. Who know what - good, bad, or in between? Just want to get the facts from those who know. | Earl Moon We have had our 265 GSX a little over 2 years. Print quality has bee
Electronics Forum | Fri Apr 06 10:43:57 EDT 2007 | flipit
Hi, Anyone seeing difficulty is soldering MLFs or QFN with lead free solder? I have an MLF with 3 rows of pads on each of the 4 sides of the part and then the large center ground plane in the middle. The part is 20 mil pitch. Had good luck with l
Electronics Forum | Sat Jan 12 15:37:33 EST 2013 | mwac
If the machine is printing with an offset on all products, then yes the printer needs to be calibrated with the fixture. That particular model requires the same tools as the 500 and 1500. They were different from other MPM machines of that or prior
Electronics Forum | Thu May 06 09:24:06 EDT 1999 | Joe Manzur
Kevin, We are also looking at printing adhesive. Our application involves printing glue on the underside of the board, once it has gone through the dip, axial & radial process. In otherwords, there are leads cut and clinched and we have to mill out
Electronics Forum | Mon Jul 17 13:37:35 EDT 2006 | carln
Here is something I copied from Circuitnet.com. This appears to answer your question and then some... http://www.circuitnet.com/experts/ Ask the Experts Jul 17, 2006 What type of cleaner method is preferred for lead-free stencils? What type of s
Electronics Forum | Mon Jan 09 13:11:07 EST 2006 | Joe
I assume you're using a no clean Pb/Sn paste, with a metal squeegee. Here are some generic procedures for good printing results for all pastes. Clean and dry the stencil well using alcohol and vigorously rubbing it with lint free towels, blow it off
Electronics Forum | Tue Mar 13 11:50:21 EST 2001 | gsmguru
Here is some general things I usually ask myself when having trouble with BGA's What type of BGA ? Pitch/Bump Dia etc. Smaller bumps sizes & tighter pitches require more attention. This also impacts stencil aperature design & paste selection. Was
Electronics Forum | Thu Aug 23 16:41:06 EDT 2001 | slthomas
Naw, the rest of the BOARD we use them on. Same assembly. Actually we use them on one other assembly and have the same problem. Same oven, same line, same paste, same problem. I've tried to get the production super. to move them to another line w
Electronics Forum | Thu Jan 03 08:02:53 EST 2002 | davef
Slump is a function of the particular paste you select and the temperature of the paste. Use a slump test like the one that follows to compare fluxes. Slump Test Step Process activity 1 Print paste on white ceramic substrate or microscope sli
Electronics Forum | Tue Oct 01 16:18:16 EDT 2002 | davef
Q1: Is this [paste in hole] feasible? A1: Yes, many people lower their operating cost by reflowing through hole components. Q2: What types of components are difficult to do this way [paste in hole]? A2: Types of through hole components that are d
