Electronics Forum | Wed Sep 23 19:07:31 EDT 2009 | sbayeta
Thanks to all for the great replies. I guess we'll buy a stencil for a few hundred bucks and try this. Anyway, nobody expressed an opinion about the "decoupled" glue dispensing. What do you think about this idea? Thanks again for your help. Best r
Electronics Forum | Thu Sep 24 17:36:12 EDT 2009 | davef
Both of the articles talk about pockets cut in the contact side of the stencil that correspond to components [or PTH leads] that would allow PTH first, glue second, and finally second-side SMT placement.
Electronics Forum | Mon Sep 28 15:43:55 EDT 2009 | davef
Search the fine SMTnet Archives to find threads like: http://www.smtnet.com/Forums/Index.cfm?CFApp=1&Message_ID=39954
Electronics Forum | Mon Oct 12 13:28:56 EDT 2009 | swag
When you teach the fid on the PCB and the camera then changes to stencil image, is it in close physical proximity to the feature/fid you wanted or do you have to move quite a bit?
Electronics Forum | Wed Nov 18 06:13:26 EST 2009 | reash
Those all appear to be automatic. We don't need something that large and expensive. We just need something for low volume.
Electronics Forum | Tue Dec 01 11:29:34 EST 2009 | sigmaprint
Have you considered a refurbished SMTech Benchmark printer from SigmaPrint? http://www.sigmaprint.co.uk/sigma-news/pre_owned.htm
Electronics Forum | Mon Dec 07 13:32:53 EST 2009 | ceiaen
Have you considered outsourcing the rework of the BGA? Besides the rework system, you will need: solder paste, stencils, cleaning method, X-ray, and the biggest part experience...
Electronics Forum | Fri Feb 05 09:40:45 EST 2010 | denisp
Hi! i would like to have opinion about the solder paste release. is it better on a 5mil or 6 mil thickness stencil? thank you!
Electronics Forum | Sun Feb 07 10:51:09 EST 2010 | davef
The ratio of aperture opening area to aperture wall area is a critical evaluation measure for the release of the printed solder paste. The stencil thickness has the biggest impact on area ratio.
Electronics Forum | Wed Feb 24 01:04:08 EST 2010 | dashley
Is it necessary, or beneficial to apply solder paste on the PCB pads for QFN rework? It seems that using micro stencils is not the best approach. Any guidelines or suggestions available for paste deposition techniques?
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