Electronics Forum | Thu Jun 26 21:38:31 EDT 2003 | Dreamsniper
Hi Guys, Need your good advice about this for a 5 thou stencil thickness: 0603 pad is 50mil x 40mil 0805 pad is 75mil x 45mil 1206 pad is 70mil x 50mil I want the above apertures to be in IPC STD Homeplate Design + an area reduction of 15%. Will t
Electronics Forum | Thu Dec 04 07:30:50 EST 2003 | ex maintain leader
Hi Grant, I'm ex Fuji Service Engineer, Fuji GP 6xx is the best but for companies in ultra high tech (2 side cleaning+ long life operating, BUT not easy to teach the technicians). Ask Panasert create series is also well durable, but I newer use yust
Electronics Forum | Fri Jan 16 07:06:47 EST 2004 | Mika
Component manufacturer often have recommendation for pad layout and process setup. This should be used as a guideline to help You to set up the process. Exactly what type of component is this, uBGA? We populate 64 I/O uBGA's on our pcb's with 0.3 mm
Electronics Forum | Thu Mar 04 14:37:44 EST 2004 | cyber_wolf
Try buying your paste in 500g pyles cartridges .You can use these cartridges in a standard caulking gun. Also.. have your paste vendor supply you with some empty jars.(They will usually do this free of charge) Whenever you run a job, dispense paste
Electronics Forum | Thu Mar 04 22:57:32 EST 2004 | Ken
I have an Aqueous Technologies stencil cleaner and I can see many SAWA advantages over the "larger" machines. 1. Floor space savings 2. Chemical cost (up to 30 dollars a gallon) 3. Hand ultra sonic cleaning could never destroy the webbing and bon
Electronics Forum | Tue Mar 09 14:22:09 EST 2004 | billschreiber
There is an article on our web site by Richard Clouthier, �SMT Stencil Cleaning: A Decision That Could Impact Production.� He talks about how high pressure sprays can damage the delicate land mass areas between fine-pitch apertures. High pressure ai
Electronics Forum | Tue Apr 13 19:47:05 EDT 2004 | davef
Glue has different mechanical, thermal, and electrical properties than solder. That's why all these very nice no-lead people are furiously trying to gin-up some wacky solder alloy, rather than using glue. Among the papers in the SMTA Knowledge base
Electronics Forum | Thu Apr 15 16:13:13 EDT 2004 | pjc
Best recommendation is to compare the two machines with your boards and stencils. Either vendor should be able to arrange for a �test drive� at one of their demonstration facilities or at a local friendly customer. I�m afraid that your request for �o
Electronics Forum | Thu Aug 05 05:23:13 EDT 2004 | Bryan
Hi All,per my understanding ,the fail mode is the heel fillet of QFP seems no good,right?If yes...I think..we should:1.increase the aperture length on stencil and make sure there's enough solder paste on pad before reflow. or you can increase your t
Electronics Forum | Wed Jul 21 01:27:17 EDT 2004 | simmcircuits
Hi, I need help in aligning the stencil and the board on an MPM AP25. I have no calib jig and stencil what I did was edit w/dos editor the file ap.cal. It seems to be working OK now just a little bit of offset but what I'm concerned is the software t
