Electronics Forum | Tue Jul 17 18:19:09 EDT 2001 | dave
CONNECTOR, 4 X 40, MALE, SM, 0.472 STANDOFF301-00030TOLC�Mount(1,27mm),.050",(0,64mm) .025",micro pitch Looking for someone who has had experience placing this Samtec style of connector .We are having issue with open solder and insufficent. We are no
Electronics Forum | Mon Aug 27 15:03:40 EDT 2001 | davef
Essentially, you want to ruggedize this component. Various adhesives could work great, depending on the source of the energy that is causing the solder connection fatigue. So, what are your looking to: * Rigidly bond the component to the board? * A
Electronics Forum | Tue Oct 01 08:01:23 EDT 2002 | mjz289
WE USE A HELLER 1500 EXL OVEN (5 ZONE OVEN) AND HAVE BEEN DOING PBGAs FROM 292 TO 780 BALLS WITH .O32" PITCH (.8 mm) AND METAL STIFFENERS ON TOP WITH NO PROBLEMS. I AM GETTING 210 - 215 DEGREES C AT THE BGA BALLS WITH 50 - 65 SECONDS ABOVE LIQUIDUS
Electronics Forum | Fri Feb 27 15:48:13 EST 2004 | pdeuel
Dose anybody know of a method of preventing board sag in the wave process. We have a 2 year old Deltawave. The product we are running is a one sided 10in x 12in panel of 6 PCB's. Pin headers and connectors are near all of the edges. Our current board
Electronics Forum | Fri Dec 02 09:51:05 EST 2005 | whippingpost
I have an assembly that uses several different BGA packages. During troubleshooting we have found that some of the balls in the corners of the BGA's are separated from the underside of the package. The PWA is approx 10�x10� and the components vary fr
Electronics Forum | Mon Mar 13 04:37:13 EST 2006 | Daniel
Hi Experts, We have requirement from our customer to control the PCBA flatness at 10 mils diagonally. Weird but this is the requirement due to the need for some through hole pins (spreaded acroos the board must touch the copper sheet while they are
Electronics Forum | Sat Jan 19 10:56:26 EST 2008 | slthomas
Dave that's actually what I want to work on the next time we run these. Our issue with these right now is that weight distribution on the boards mandates that we break a 4-up panel into two pieces and run it 90 degrees to the ideal orientation (=s wh
Electronics Forum | Mon Mar 10 20:14:20 EDT 2008 | davef
We'd be unhappy with features that are not in copper that is at the same level as the component pads, because of difficulties the fabricator would have in maintaining registration between the copper pads and the ink used for the features not in coppe
Electronics Forum | Fri Jan 18 14:24:07 EST 2013 | davef
Here's the story: * Solder will melt and alloy with the solder alloy that you have in the pot. * Flux will smoke, smell and leave schmutz floating on the surface of the solder in the pot. While the amount of smoke, smell and schmutz are variables, b
Electronics Forum | Tue May 21 15:00:28 EDT 2019 | emeto
Hello Greg, Here are a few questions and advises that might post an answer: 1. How thick is your current stencil and what is the part that requires that thickness? 2. Can you use a carrier to keep your board straight and avoid board warpage? May
