Electronics Forum | Tue Jul 14 07:12:53 EDT 1998 | smd
I asked the same question a couple of weeks ago. I received a lot of e-mail from salesmen et al trying to sell me equipment costing several thousand dollars. I was glad to get all the information I could, but there was no way I was going to get a PO
Electronics Forum | Mon Jun 08 15:00:08 EDT 1998 | Earl Moon
| I work QA at an OEM in Alberta, Canada. I saw earlier posts on the smtnet regarding PCB haloing criteria. I am currently in a dispute with my PCB vendor over the acceptability of haloing (delamination) around plated through holes and vias on a lot
Electronics Forum | Wed Jun 03 07:02:25 EDT 1998 | Earl Moon
| Does anybody know if a contraption exists that will minimize a PCB's tendency to become slightly bent after reflow? We have a new product that we're planning to assemble in a couple of months. The board is 9.7" by 13.4" and it is imperitive that
Electronics Forum | Fri May 29 17:48:34 EDT 1998 | Earl Moon
| | | We recently made the switch to no-clean and the wurface mount is turning out beautifully. However, the wave solder process continues to put up a fight; we are getting a white residue on the surface of the PCB. The residue is not localize
Electronics Forum | Sat May 30 08:24:09 EDT 1998 | Dave F
| | | | We recently made the switch to no-clean and the wurface mount is turning out beautifully. However, the wave solder process continues to put up a fight; we are getting a white residue on the surface of the PCB. The residue is not locali
Electronics Forum | Sat May 30 12:51:29 EDT 1998 | Earl Moon
| | | | | We recently made the switch to no-clean and the wurface mount is turning out beautifully. However, the wave solder process continues to put up a fight; we are getting a white residue on the surface of the PCB. The residue is not loca
Electronics Forum | Sun Apr 05 18:59:15 EDT 1998 | Graham Naisbitt
Jaqueline There are so many variables in the electronic assembly manufacturing process involving more than 12 different chemistries, that it is impossible to easily identify and determine the nature and reason of such residues. GEC Hirst Research in
Electronics Forum | Wed Jan 09 20:40:58 EST 2002 | ianchan
Since we are on the topic, What we do over here, is to get SMT Technical to machine pick&place "sample component layouts" onto double-sided tape, which in turn is placed onto an actual PCB... QA will take that double-sided tape sample, and using an
Electronics Forum | Mon Apr 01 19:57:07 EST 2002 | davef
Selective soldering machines are a good way to "finish automation", if the design of the PCB is conducive to the application with just a few components to solder. Your points are good. A decision matrix for selecting a machine might also include:
Electronics Forum | Fri May 03 10:51:24 EDT 2002 | fmonette
Dave is correct. I am including additional information that comes from a recent posting on another industry forum : The proper guidelines for bag sealing are actually specified in the JEDEC standard EIA/JEP124 section 5.2.1 Packing moisture-sensiti
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