Electronics Forum | Mon Apr 05 17:47:21 EDT 2010 | boardhouse
Hi Deni, X-ray will not be able to see through Power and Grn planes. Your only way to find out is: 1) ask your board supplier to supply stack up used. 2) surface grind layer by layer to validate if it is correct stack up. What is making you think
Electronics Forum | Mon Jun 14 15:18:49 EDT 2010 | jmedernach
Hi Phil, If the areas that are "turning gray" are masked, it would lead me to believe that you're simply oxidizing the SnCuNiGe finish on those areas. It's unsightly but not an actual defect. I think it's simply the biproduct of using SN100C as a s
Electronics Forum | Wed Jul 21 12:19:01 EDT 2010 | mb_mfg
To eliminate warping during processing, we have provided customers with composite fixtures to support the board on all 4 edges, with retractable pull down claps that can be added to the top of the PCB after the screen printing. Simply by pushing the
Electronics Forum | Fri Dec 03 04:20:18 EST 2010 | grahamcooper22
Hi In Dec 2008 the IPC J STD 004 was updated to 004B, and I am wondering what the new test conditions are for testing flux Surface Insulation Resistance and Electro Migration Potential within the new spec. I am looking for the recommended test temp
Electronics Forum | Thu Dec 09 07:21:10 EST 2010 | scottp
You won't have 2 mil height because the solder doesn't remain brick shaped. It's a dome. In the past I tried doing some calculations using the formula for the volume of a spherical section and also tried using a simulation program that accounts for
Electronics Forum | Mon Dec 20 16:22:45 EST 2010 | rkondner
When you say Fine Pitch is this .5mm or is it smaller? I wonder what problems they experienced with HASL, the only problem I recall hearing was the surface was not flat. When applying paste with a stencil I can not see how the flatness is an issue.
Electronics Forum | Fri Jul 22 11:10:27 EDT 2011 | ccouture
It's actually a "silane" according to the same article. Also, it "bonds" with the surface of the stencil. once bonded, it's not going anywhere. I'm not a chemist. I'm not promoting this product to be used on stencil. I'm just pointing out that what i
Electronics Forum | Thu Jun 23 23:58:03 EDT 2011 | jamessunderland
Just want to ask. What is the effect of dull gold surface on solderability? When I made a test run with several pieces containing dull gold defect on the pad(of varying levels), I found that components can still stick to the pad with good amount o
Electronics Forum | Fri Sep 02 16:22:37 EDT 2011 | ttaubert
Are there SMT mechanical components like that could be used for orientating PCB-level optics on the board and do not require holes in the board? Their final position would solely depend on the reflow. A height of 1/8" would be sufficient. I was con
Electronics Forum | Mon Sep 12 07:03:26 EDT 2011 | mosborne1
Can you post a picture? There are many reasons why they probably don't fill. There needs to be a larger surface area on the ring on top. There could be debris in the via holes from not properly drilled or cleaned before plating process. Your customer
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