Electronics Forum | Tue Aug 29 17:05:00 EDT 2000 | Travis Slaughter
There are a large number of variables that determine how many tabs are needed. The biggest ones I can think of, off the top of my head are. Board thickness .031 needs more than .093 Process and equipment used in assembly some processes and equipment
Electronics Forum | Mon Jun 19 21:37:14 EDT 2000 | Dave F
Mike: Look a the Hadco DFM manual ( http://www.hadco.com/ ) Yano if you�re lookin� for uniformly smooth (not silky smooth) board edges, have you considered scoring to separate your boards? Scoring has: * Minuses (straight lines only, stress on so
Electronics Forum | Tue Jun 20 20:31:12 EDT 2000 | Dave F
Chrys you're fine. On scoring: * Be sure spec material remaining, not what is removed. * Be sure that the v-grooves are perpendicular to each other, not off set. * Typ spec for for .062 thick boards FR-4 0.018-0.024 MC-3 0.030-0.040 * HADCO recomm
Electronics Forum | Sun Jan 23 03:23:09 EST 2000 | Rob Steltman
Hi We use a U-channel piece of high temperature silicon which is just pushed over the gold tabs before the soldering process. The silicon can be used over and over again. The advantages are that there is no mask on the board during the SMT process a
Electronics Forum | Wed Jan 05 07:40:06 EST 2000 | jacob lacourse
we have looked into a number of depaneling machines and can't justify the cost. what we are trying to do is to eliminate failures due to part stress when employees are breaking out the boards by hand. I heard about pneumatic scissors one day but to
Electronics Forum | Wed Jan 05 15:00:23 EST 2000 | Brian E. Steelglove
Dear Jacob, I have a company that makes a really cheap but great depanelizing machine and one to get rid of the tabs on a routed FR 4 board. I saw them at the assembly expo in Chicago. The cost is under 2,000 dollars and works well. I think it mig
Electronics Forum | Mon Nov 08 19:10:10 EST 1999 | Brian W.
Oh boy, does that bring back memories!!!!! You are most likely breaking components when the board is flexed during separation. Any components perpendicular to the score are candidates for mechanical stress. We overcame the problem by making our ow
Electronics Forum | Wed Jun 16 13:36:37 EDT 1999 | Earl Moon
| A potential customer of our is inquiring if we have capability | for Hot Bar manufacturing in the PCBA manufacturing world. If someone can explain to me what this entails, I would greatly appreciate it. Thank you. | One of the earlier uses for
Electronics Forum | Sun May 23 07:13:56 EDT 1999 | Scott Cook
| Has anyone had any experience or data using vibration during the reflow process. | We introduced a vibration device attached to the fixed rail on a Vitronics reflow oven. The reason was to prevent skewing on large PLCC devices. The process worked v
Electronics Forum | Wed Jan 20 12:04:44 EST 1999 | DDC
Need to know from your experience a set of smt equipment for low volume manufacturing (approx. 800K parts/yr). Types to handle are standards i.e., 0404-7343, soic's, plcc's, pqfp, tsop, soj, BGA, chip res. smt conn. I would like to know a recommende
