Electronics Forum | Wed Aug 25 01:25:49 EDT 1999 | Gyver
| | | | | | Hello everyone, | | | | | | We found many cylindrical diodes missing during SMT process. Could someone tell us how to prevent this problem? Is it effective to change the shape of stencil apture or reduce fan speed in reflow oven? Thanks i
Electronics Forum | Wed Aug 18 17:25:58 EDT 1999 | Earl Moon
| | | | OK folks, let's get real serious. | | | | | | | | Well, I shot off my big mouth yesterday during a scheduling meeting concerning DFM and rework. Again, what an irony, oxymoron, or that other thing. | | | | | | | | Anyway, I said it would ta
Electronics Forum | Thu Aug 05 13:03:35 EDT 1999 | Dave Weihrauch
| | | | Has anyone out there tried to parylene coat plastic parts prior to soldering them to a pcb? I'm looking at several potential applications where fewer than 5% of my components on a pcb are plastic, yet from a reliability aspect (environmental
Electronics Forum | Fri Aug 06 07:18:48 EDT 1999 | Graham Naisbitt
| | | | | Has anyone out there tried to parylene coat plastic parts prior to soldering them to a pcb? I'm looking at several potential applications where fewer than 5% of my components on a pcb are plastic, yet from a reliability aspect (environmenta
Electronics Forum | Fri Jul 23 23:47:03 EDT 1999 | Scott McKee
| | | There is a practise within the industry of an Inspector inspecting a board, and that same Inspector performing touch-up. My opinion is that the Inspection and Touch-up operations should be separate functions whereby the Inspector is not perform
Electronics Forum | Wed Jun 30 08:58:59 EDT 1999 | M Cox
| | | | snip | | | | | John and Dave, | | | | | | Again, I don't work with larger chip devices with this issue. The company I now work with developed a strategy, based on considerable research (as others of us did in the past), to do things like p
Electronics Forum | Wed Jun 30 09:33:11 EDT 1999 | Earl Moon
| | | | | | snip | | | | | | | John and Dave, | | | | | | | | Again, I don't work with larger chip devices with this issue. The company I now work with developed a strategy, based on considerable research (as others of us did in the past), to do t
Electronics Forum | Fri Jun 18 10:46:10 EDT 1999 | Scott Cook
| | | first of all what is the technical term for the small amount of solder on a plated pad. we are getting poor screen printing gasketing on a 20 mil qfp due to this solder not being even or too high in spots and not covering the length of the pads
Electronics Forum | Thu Jun 10 21:43:18 EDT 1999 | Dean
| | Does anyone out there involved in RF manufacture have any experience with the KIC Slim-Kic profiler? Do you find any interference problems between the RF transmissions and the testing of your products. We build primarily high-freq stuff like poin
Electronics Forum | Tue Jun 08 15:04:06 EDT 1999 | JohnW
| | | Hi,my master | | | How to iron out such soldering bridge with below conditions: | | | 1.The component(Harness)lead pitch is 2.0mm,the lead length is 3.2mm. | | | 2.PCB width is 1.6mm.Pad size is 1.65mm.Its a single copper PCB | | | 3.using s
