Electronics Forum: telling (Page 136 of 308)

Re: smt component identification

Electronics Forum | Mon Sep 06 22:24:51 EDT 1999 | KEVIN SIMPSON

| Please excuse my ignorance, I am a brand new EET student. Can | someone please tell me how to identify smt components on a pcb? | ie: which is a resistor, capacitor etc, and what do those tiny | numbers mean? My digital prof. did not know!!! Tha

Where can I get delmat material

Electronics Forum | Wed Aug 25 09:51:37 EDT 1999 | Mike F

Can anyone tell me where I can get a good lightweight material to use for a soldering fixture? I need to make various fixtures to hold LED's vertical during the soldering process, and keep them from floating up off the board surface. At a different

Re: Where can I get delmat material

Electronics Forum | Wed Aug 25 10:05:56 EDT 1999 | Ray Hare

| Can anyone tell me where I can get a good lightweight material to use for a soldering fixture? I need to make various fixtures to hold LED's vertical during the soldering process, and keep them from floating up off the board surface. | | At a dif

Re: Cylindrical diodes Missing during SMT process.

Electronics Forum | Tue Aug 24 16:11:21 EDT 1999 | Scott Cook

| Hello everyone, | We found many cylindrical diodes missing during SMT process. Could someone tell us how to prevent this problem? Is it effective to change the shape of stencil apture or reduce fan speed in reflow oven? Thanks in advance. | | Gyve

Electroless Tin Plating

Electronics Forum | Fri Aug 20 11:24:54 EDT 1999 | Chuck B.

I am being asked, by my vendor and Purchasing people about converting from Tin/lead pads on P.C.B's to Electroless Tin Plating. Can any one tell me what I have to change in my SMT process (paste, reflow, etc) If any? I ran one P.C.Board and I

Re: Nitrogen Oxygen effect on solder ball apperance

Electronics Forum | Mon Aug 16 09:50:20 EDT 1999 | Earl Moon

| Hello reflow experts, | | I just wanted to know the effects of N2 and O2 on reflow furnace to the solder ball apperances. | | thanks in advance.... | | ...Omat | | Not really that much with eutectic balls and solder pasted pads and the reflow

Re: Solder Paste volume w/reliability data.

Electronics Forum | Fri Jul 30 15:41:16 EDT 1999 | M.L

| | Looking for solder paste specification limits which have reliability data to support them. Currently, we are looking to define the min/max volume necessary to ensure a good joint on CBGA, PBGA, and Micro-BGA's. Any information will be greatly a

X-Ray for CSP devices

Electronics Forum | Thu Jul 15 07:16:55 EDT 1999 | Steve

Hello All, I am setting up a line to mount CSP/uBGA devices and now am looking at the X-Ray process. It is my opinion that this should be done offline - can you tell me if Im right or do I need to put one inline? Also anyone who is mounting CSP/uBG

GSM1 power requirements

Electronics Forum | Wed Jul 14 12:03:53 EDT 1999 | greg c.

i have worked with the universal gsm in the past and am now helping out a contracting company who is setting up one in their facility. My question is: the power requirments for the machine calls for 3-phase 230V, does it really need 230V or is the s

Re: GSM1 power requirements

Electronics Forum | Wed Jul 14 15:06:33 EDT 1999 | M Cox

| i have worked with the universal gsm in the past and am now helping out a contracting company who is setting up one in their facility. My question is: the power requirments for the machine calls for 3-phase 230V, does it really need 230V or is the


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