Electronics Forum | Thu Apr 17 10:38:02 EDT 2003 | davef
While Russ is correct that a little voiding is OK, your level of voiding [customer complains that the solder surface looks bumpy] doesn't give us the ol' warm and fuzzy about their process control. For background: * Search the fine SMTnet Archives.
Electronics Forum | Fri May 02 12:41:16 EDT 2003 | Chris Lampron
Hi Chris, I had worked for a flex circuit house for 10 years. You should be able to follow your solder paste guidelines for times and temps. You may want to consider pre-baking the flex if it is made with Kapton. Kapton is Hygroscopic and will delam
Electronics Forum | Tue Jun 10 10:58:54 EDT 2003 | Frank
Hi, I currently work on SMT department to uptimize all process. I've just selected the solder paste after testing 15 different products. To be able to do that, I had to create a procedure to evaluate each paste and to be sure that my profil was per
Electronics Forum | Mon Oct 06 11:13:32 EDT 2003 | marmotzj
Dear All, I'm encountering a problem on mounting Intel E7501 and P64H2 FC-BGA chips. After the SMT process, these two BGAs were defected. Both had power-to-ground short circuits on the die package itself, and also the die resin had cracking tracks
Electronics Forum | Fri Dec 12 11:52:59 EST 2003 | Marc Simmel
I have encountered problems with a 90/10 tin-lead plated SMT component wicking all the solder paste off the pads on the substrate. Worst, the defect occurs randomly - adjacent leads may have 'good' joints, though heel fillets are poor. The solder pa
Electronics Forum | Tue Feb 17 17:55:38 EST 2004 | bman
I might be saying something that will get me laughed off of SMTnet forever, but when faced with a similar problem here's what I did. Since I was removing parts I didn't see why I would be concerned about all the things that go on in a good temperatu
Electronics Forum | Wed Mar 24 15:48:33 EST 2004 | davef
KIC Thermal Profiling did a DOE [Nepcon West 1999] [you probably can find it posted on their site] on thermocouple attach. Comparing the reliability and repeatability of thermocouple attachment methods: * High temperature solder was found to be the
Electronics Forum | Mon May 24 05:53:24 EDT 2004 | johnwnz
Here's an interesting fact, some pastes just don't wet as well as others!.. there I've said it and now people will complain but that's life. Some pastes are formulated to run in air, some in N2, soem are specifically designed to be more aggressive fo
Electronics Forum | Mon Aug 09 02:40:25 EDT 2004 | abraham
We find that the component industry has migrated to lead free components whereas our process is still not leadfree. We receive components from suppliers of which some are lead free and others are not. We populate both types of components on the same
Electronics Forum | Wed Aug 25 21:25:28 EDT 2004 | davef
First as a nit, your �substrate� is probably NOT copper. It�s probably FR4 fiberglass/epoxy. Substrate. Base Material. A supporting insulating material upon which parts, components, and elements are attached. Second, enough of that, on to your i
