Electronics Forum | Fri Jan 07 10:27:07 EST 2011 | patrickbruneel
Hi, Detergent/saponifiers have indeed the potential to tarnish aluminum. This is due to the high alkalinity of the chemistry (pH 10-12). Things you can do to minimize the effect is: A) Limit the exposure time of the Al with the chemistry. B) Reduc
Electronics Forum | Tue Feb 01 10:11:36 EST 2011 | clampron
good Morning, it looks from the peak temperature that this is a RoHS application? If so, is the BGA that you are having issues with leaded? If so, you might be experiencing "ball drop" where the ball becomes disconnected from the component substrate
Electronics Forum | Tue May 10 15:44:24 EDT 2011 | davef
From your graph, we just don't see the the relationship between failures and relative humidity. Questions are: * What is the correlation between failures and RH? [We'd bet that the correlation between failures/RH and failures/temperature are 'similar
Electronics Forum | Wed Jun 01 15:50:59 EDT 2011 | markhoch
I don't believe that particle size of the solderpaste will offer you any relief from this issue. The solder flows into the via, leeching away from the desired solderpoint, after the solder has become liquious. The chemical make-up of the solder contr
Electronics Forum | Tue Jun 14 17:32:44 EDT 2011 | davef
It depends on the flux and the down-stream processing ... * If there is adequate down-stream cleaning: We are ambivalent. * If the flux is low residue and there in no down-stream cleaning: We don't like using a syringe because it squirts liquid flux
Electronics Forum | Wed Aug 03 11:21:34 EDT 2011 | davef
We don't know what you mean by 'high temperature' Board storage racks * FKN Systek http://www.fknsystek.com/PCB%20Racks.htm * US Plastic http://www.usplastic.com/catalog/item.aspx?itemid=24577&catid=745 * All-Spec http://www.all-spec.com/products/
Electronics Forum | Fri Aug 19 02:05:32 EDT 2011 | ppcbs
We have been developing profiles for BGA process going on 14 years now. We have never had to drill holes or resort to any type of destructive methods for BGA assembly, rework or defect analysis. Depending on requirements, i.e BGA rework or BGA assem
Electronics Forum | Thu Aug 04 20:35:33 EDT 2011 | zywong
Hi All, I'm facing a problem is the PCBs are having delamination issue which after SMT reflow process & wave solder process. Dose anybody faced this issue before? The profile setting are correct settings. Some question i wonder: 1) Is that long time
Electronics Forum | Mon Aug 29 21:36:39 EDT 2011 | davef
We agree with JAX. Changing the pads on your board as you describe won't do shit. Possible solutions to a cold solder connection problem include: * Raise the peak temperature to be high enough to reflow the material thoroughly. * Select a solder pas
Electronics Forum | Tue Jan 10 22:10:29 EST 2012 | doncattoni
Hello Austin, Sorry for the delayed response. There are different types of cures for conformal coating such as RTV which stands for Room Temperature Vulcanising which means they are cured by the humidity in the air. This type of cure does not need
