Electronics Forum | Thu Nov 19 10:24:14 EST 1998 | Brian Co nner
Currently, I am having problems with a AMP Mictor connector at the wave process. These connectors have both SMT leads(topside) and thru-hole leads. Even though we have re-designed the board for via issues. We still see some of the SMT leads re-fl
Electronics Forum | Wed Sep 30 20:56:31 EDT 1998 | Tony Barry
Assuming that your components and PCB's have good solerderabillty and are stored in an air conditioned environment and kept free of contaminants then your problem sounds as though there is insufficient wetting of the component leads due to low temper
Electronics Forum | Tue Aug 25 16:28:11 EDT 1998 | Al Knudson
Hello, Our PWB supplier has requested that a change in the laminate material to reduce the incidence of pad lifting. The standard laminate materials (Polyclad PCL-FR-226 with a glass transition temperature of 135 C) have greater z-axis thermal expan
Electronics Forum | Thu Jan 22 03:18:02 EST 1998 | Eldon Sanders
I'll bet the rate of temperature change may be the problem. A large black thin package will heat quickly, and the package peak temp will be greater than what you measured on the board. The bottom of the package will heat slower than the top, creati
Electronics Forum | Sat Jan 10 12:14:26 EST 1998 | eyal dickerman
I'm suprise that you are not evaloating HELLER ovens ,It is the best ,relaible oven in the market for more than 5 years. They are using the same heater/blower technology from the same manufacturer for years... HELLER offers LIFE WARRENTY for the heat
Electronics Forum | Tue Apr 09 00:09:25 EDT 2002 | craigj
Question. When profiling and looking at the profiles cooling rate. Over what temperature range should the slope be monitored and what sort of cooling rates should be looked for. Paste supplier says no more than 6degC per sec, some components maybe lo
Electronics Forum | Tue Apr 09 08:44:43 EDT 2002 | davef
Read IPC-7530 "Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)". There is no advantage in dropping off much faster than 4�C/sec. In fact, you risk fracturing your newly formed solder connections due to board warping
Electronics Forum | Tue May 07 07:38:13 EDT 2002 | ianchan
Hi mate, checked with one of our egg-brains in the factory (freakin' workaholic still around at this time of night), he tells me that Ag-based PCB finishings share rather similar reflow temperatures for normal Sn/Pb applications. this means (if he i
Electronics Forum | Tue May 28 17:50:20 EDT 2002 | myu
Hi, Everybody! I'm looking for a High-Temperature Solder Paste / wire: "Pb93WROL140.71454";or "00Z890"; J-STD-006 Solder Alloys Sn05Pb93Ag02B Sn% Pb% Ag% Solid C Liq C Solid F Liq F 5.0 92.5 2.5 280 284 536 543 It should meet IPC/J-ST
Electronics Forum | Thu May 30 10:45:16 EDT 2002 | sjpence
We got a similar alloy Sn05Pb93.5Ag1.5, of Alpha Vaculoy bars. It is not the eutectic alloy you were looking for but it is close. This alloy and similar high temperature alloys are used in downhole electronics and so a supplier in the Houston area
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