Electronics Forum | Thu Nov 26 06:07:40 EST 1998 | Earl Moon
| I have some 1.25 mils Al wire bonding chip on board process. After epxoy-based encapsulation, I do some aging test. How can I "see" or prove that there is a "wire break" exist due to the tension of thermal cycling? How can I know the failure is cau
Electronics Forum | Fri Nov 27 02:09:50 EST 1998 | Chi-Ting Chen
| | I have some 1.25 mils Al wire bonding chip on board process. After epxoy-based encapsulation, I do some aging test. How can I "see" or prove that there is a "wire break" exist due to the tension of thermal cycling? How can I know the failure is c
Electronics Forum | Fri Nov 27 02:11:17 EST 1998 | Chi-Ting Chen
| | I have some 1.25 mils Al wire bonding chip on board process. After epxoy-based encapsulation, I do some aging test. How can I "see" or prove that there is a "wire break" exist due to the tension of thermal cycling? How can I know the failure is c
Electronics Forum | Wed May 27 10:19:43 EDT 1998 | Jerry
We have no problems but orientation does matter. Orient with longest side of component body perpendicuar to wave. In other words the same preference as with through hole DIPS. Idea is the same as for through hole, that the surface tension will ten
Electronics Forum | Wed May 20 12:01:16 EDT 1998 | Chrys
Have you tried the new Accu-Frame from PNC? It tensions on all four sides using an operator-INdependent mechanical scheme. It seems pretty slick. They're failry new, and don't have a frame for the MPM's last time I checked, so I haven't tried it m
Electronics Forum | Sat Mar 21 12:19:51 EST 1998 | David Pick
I have read somewhere of a ratio of component weight vs. surace contact area rule for double reflow soldering. This ratio is the maximum weight vs. surface tension to hold a component on during the second reflow. With this number, a person could weig
Electronics Forum | Wed Sep 26 11:54:02 EDT 2001 | Stefan
John, you mention yourself that this problem is component related. Is the 1206 presented out of a plastic tape?. The tape could be more slippery than the paper tape and the cover tape may pull the tape out of position. I am not familiar with the Juk
Electronics Forum | Tue Jan 28 17:10:21 EST 2003 | sajulius
I've seen this problem on more than one wave,What i've done is to run the conveyor a little faster,use a solder temp of 505 degrees F,and most important is to make sure that the solder is flowing over the back. this will keep the thin buildup of dros
Electronics Forum | Wed Mar 05 08:12:56 EST 2003 | nifhail
Hi Mike, How do we measure the O2 ppm in N2 environment. I don't understand why the customer keep insisting me to use N2 instead of Air. I don't see the need for it as I done have any soldering issue. Can you share with me why N2 is needed at the fi
Electronics Forum | Wed Apr 30 09:22:26 EDT 2003 | gregp
Sounds like PSA cover tape. Contact Siemens about this. There may be an adjustment or modification to the feeder to stop it from delaminating the tape. This is generally a problem in feeders that have continuos tension on the take up mechanism (su
