Electronics Forum | Wed Feb 21 08:48:37 EST 2007 | rgduval
Ideally? Never. You risk component break down by re-running the board over the wave machine. In a perfect world, your wave operator would make adjustments after one run, and you'd run another panel over the wave to judge the effectiveness of the a
Electronics Forum | Thu Mar 29 13:15:18 EDT 2007 | adrian_nishimoto
We always apply solder paste to either the PCB pads or the BGA balls. I have found that only using liquid or tacky flux does not always ensure proper wetting of the pads. Also The BGA sits closer to the PCB making cleaning and endoscopic inspection
Electronics Forum | Thu Apr 17 10:44:24 EDT 2008 | rculpepp
I'd suspect contamination also, possibly from the board supplier. Sr. Tech's post mentioned what looks like a blister on the board, in the upper right of the Q19 photo. This could very well be a contaminate from the PWB fab shop. I've seen similar pr
Electronics Forum | Tue Aug 18 10:11:04 EDT 2009 | grantp
Hi, Yes, I think this sounds like a form of tomb-stoning, and we used vapor phase until it ended up driving us totally nuts trying to deal with tomb-stoning. We tried everything, and all kinds of stencil apertures. Vapor phase is an amazing process
Electronics Forum | Tue Oct 20 10:31:50 EDT 2009 | lloyd
Seth, From the Siemens technical information document: Raceway monitoring detects incorrect positioning of the Z axis with respect to the raceway during motion of the star. This is done by monitoring the current drawn by the Z axis while the star i
Electronics Forum | Thu Feb 04 02:46:39 EST 2010 | dilogic
OK, here we are: 1. OS is OS&2 2. Sw. is USOS V1.14 3. GSM1 4. 2 Flex2 heads 5. Problem is on the front head 6. No 7. No 8. It just stops in the middle of the placement phase, with the head over PCB area. Usually 2 parts are still held on the nozz
Electronics Forum | Tue Oct 05 15:39:35 EDT 2010 | daxman
Hi Steve, I don't know if there are a lot of people who can decrypt the trace data. I think the manual mentions sending it to fuji for analysis. Maybe that would be something worth checking into. Regarding the Mecca check mode: I don't know if it wi
Electronics Forum | Fri Nov 11 13:52:05 EST 2011 | SheanDalton
What is the size of the low standoff components you find trace wash effluent? and, what is the gap from the board to the underside of the component? If your component has a very low standoff, and/or, a wide footprint, you may want to consider findi
Electronics Forum | Fri Dec 09 15:10:55 EST 2011 | davef
Can you use the equipment manual as the basis for learning how to use the machine? Each model of printer has different alignment techniques. We don't have a clue of your model type. So, we'll approach the question from its most basic point. Registe
Electronics Forum | Mon Oct 15 08:15:41 EDT 2012 | scottp
Is the designer's concern that the parts will fall off when hanging upside down during reflow? We've been doing this for decades and our test if we think a part is marginal is to glue a 2nd (and sometimes 3rd) part to the back and send it through re
