Electronics Forum | Thu Apr 29 22:50:41 EDT 1999 | Kelly Morris
Tombstoning 0805s w/palladium/platinum/silver terminations We are experiencing tombstoning problems on 0805 packages that have paladium/platinum/silver terminations. It comes & goes...... I�ve checked the reflow profile, and paste deposition and a
Electronics Forum | Mon Mar 30 08:11:22 EST 1998 | Derek Drabenstadt
Does anyone have any experience with fired-silver/platinum/palladium lead terminations soldering. I have had issues on nickel over gold plated boards but not with HASL'd boards with tin/lead pads. Is this the norm?
Electronics Forum | Mon May 03 09:42:45 EDT 1999 | Mike McMonagle
| Tombstoning 0805s w/palladium/platinum/silver terminations | | We are experiencing tombstoning problems on 0805 packages that have paladium/platinum/silver terminations. It comes & goes...... | | I�ve checked the reflow profile, and paste deposi
Electronics Forum | Sun May 02 18:52:36 EDT 1999 | JohnW
| Tombstoning 0805s w/palladium/platinum/silver terminations | | We are experiencing tombstoning problems on 0805 packages that have paladium/platinum/silver terminations. It comes & goes...... | | I�ve checked the reflow profile, and paste deposi
Electronics Forum | Thu Apr 02 08:26:36 EST 1998 | Steve Gregory
| Yes, norm it is. Look back to February 98 :discussion on this issue. Norm, That discussion does deal with palladium coated leads, but when I read your statement about silver/palladium fired terminations, I'm assuming that you're referring to
Electronics Forum | Wed Apr 01 02:19:10 EST 1998 | Eldon Sanders
Yes, norm it is. Look back to February 98 discussion on this issue.
Electronics Forum | Tue Oct 05 08:01:57 EDT 2010 | scottp
Have you confirmed in an SEM that the break is in the solder and not in the termination? If not in the termination, is it in the intermetallic rather than the bulk solder? It's unusual for the break to be in the solder joint when chips are knocked
Electronics Forum | Wed Jul 19 12:54:04 EDT 2023 | calebcsmt
Since side fillets are not a requirement for QFNs/BTCs due to some packages not having wettable side terminations, how does one determine if the side terminations are actually solderable/designed for wetting? Is it simply if the side terminations
Electronics Forum | Mon May 24 08:49:29 EDT 2004 | davef
ANSI/J-STD-002, Solderability Tests for Component Leads, Terminations, Lugs, Terminals, and Wires
Electronics Forum | Thu Jul 05 20:53:58 EDT 2007 | davef
ANSI/J-STD-002, Solderability Tests for Component Leads, Terminations, Lugs, Terminals, and Wires
