Electronics Forum: test black pad (Page 1 of 95)

black and grey pad

Electronics Forum | Sat Oct 06 05:33:47 EDT 2001 | spchua

I had recently encounter the "black and grey" pads problems for the BGA pad after the convection re-flow. The pads shows in in "black and grey" color and a litter solder in it, and it happen in ramdom, when applied heat and solder on the "black and g

black and grey pad

Electronics Forum | Sat Oct 06 08:42:21 EDT 2001 | davef

Please give us additional background on your board, solder, process, etc. If you are talking about black pad in ENIG solderability preservative, check the fine SMTnet archives to get started.

ENIG (thru hole ring turns black after wave soldering)

Electronics Forum | Tue Aug 02 15:03:37 EDT 2016 | davef

On a previous black pad experience we soldered a wire to a fiducial and did a pull test to failure. On the black pad board the wire and solder pulled of clean leaving the fiducial on the board. On good boards the copper came off with the wire. If you

ENIG (thru hole ring turns black after wave soldering)

Electronics Forum | Wed Aug 24 22:11:36 EDT 2016 | davef

I'd guess that "black pad" is not the issue that you need to address, because only 2 of your 5 test points has the problem that we seem to be discussing. I'd expect "black pad" problems to be more wide spread. Something is going on at those two locat

BGA Pull test

Electronics Forum | Mon Oct 25 17:50:46 EDT 2004 | Mike

I work for a PCB Manufacture and I am looking for info on BGA Pull test or strenght test. I have a CM that is experiencing bga's with some weak joints. they are telling me that when they do their pull test the joints are breaking at the nickel inste

BGA Pull test

Electronics Forum | Mon Oct 25 21:49:14 EDT 2004 | davef

First, any results of pull or shear tests are unscientific at best. [We pop our BGA from boards with, appropriately enough, a beverage can opener.] Second, we have no have problems with your ENIG specification. Third, as with your customer, we'd e

Black pad defect

Electronics Forum | Tue Feb 11 22:28:25 EST 2003 | davef

What do you mean by "new information"? On final module testing: * If you have hypercorroded nickel and you detect it during final testing, you'll notice it. * If you have hypercorroded nickel and you don't detect it during final testing, you'll ship

Black pad defect

Electronics Forum | Tue Feb 11 15:54:23 EST 2003 | Jodi Roepsch

I am interested in knowing if anyone has new information about the black pad defect with ENIG plating. I am interested in it from the viewpoint of risk assessment, testing done on final product to isolate failures,and root cause of the defect. Than

Black pad defect

Electronics Forum | Mon Mar 17 15:32:33 EST 2003 | Jodi Roepsch

Thanks to everyone who took my question seriously and made an effort to share information on this topic. I have done extensive literature searches on this topic in the past but am still looking for more information regarding how this defect affects

Weak joint strength and black residue

Electronics Forum | Fri Jun 08 17:22:51 EDT 2007 | naynayno

We have been producing an IMS assembly with SMT dpak's for some time. However, we recently encountered a new problem by chance - the parts can be flicked off with a finger nail. I state by chance because the solder joints are wetted and shiny with

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