Electronics Forum | Tue Apr 18 03:40:05 EDT 2006 | Slaine
Did you try tensile testing after thermal cycling? If there are any intermetalic problems between the two alloys this should show it.
Electronics Forum | Tue Oct 10 09:39:14 EDT 2006 | blnorman
Does anyone have experience with electrically conductive adhesives? We're looking to try one (don't know whose), but I'm concerned with degradation of the adhesive over time or thermal cycling. Any success or horror stories would be appreciated.
Electronics Forum | Wed Feb 07 18:40:39 EST 2007 | bill
What is an acceptable mismatch for smt components and pcb. We are having cracked solder joints from fatigue after repeated thermal cycling 25 deg. c to 125 deg.c.
Electronics Forum | Fri Mar 26 09:34:01 EDT 2010 | dyoungquist
What about thermal cycling and/or vibration over the long term? My guess is that with the voids the joint would not be as reliable long term as a joint without the void. Am I thinking correctly?
Electronics Forum | Wed Aug 24 16:30:10 EDT 2011 | hussman
Low and behold, the answer has been found. I guess 2512 parts are not used inthe automotive wolrd due to the fact that they crack during thermal cycling!
Electronics Forum | Thu Feb 07 08:10:12 EST 2013 | emeto
Thank you all for the input. There is another concern. Do you consider wave soldering or selective soldering as a thermal cycle too?
Electronics Forum | Fri Jun 21 03:05:41 EDT 2019 | gregoryyork
The only problem with non silver tin bismuth is its very prone to shock damage and components fall off,literally. Would only recommend it with Silver additions and around 1%.
Electronics Forum | Fri Jun 21 03:07:28 EDT 2019 | gregoryyork
REL alloys from Aim solders maybe worth looking into for this application. May I ask what your profile on reflow is like please, especially peak
Electronics Forum | Sun Jun 30 20:00:56 EDT 2002 | redmary
the SOIC encounter solder crack after reliability test, the common process is: SMT---manual soldering---IPT(in process test)---potting---T/C(thermal cycling,only add current and voltage)---B/T and F/T (burn in and functional test). the condition is 2
Electronics Forum | Fri Feb 13 08:54:43 EST 1998 | justin medernach
| Hi , | I have not been able to find any good description on how to perform double sided reflow on PCBs.The best would of course be to avoid reflowing the bottom side again but in real life this is not possible. | So when double sided reflow sol
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